上转换材料介导半导体键合

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598362

N. Sano, Kosuke Nishigaya, K. Tanabe

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引用次数: 0

摘要

提出并论证了上转换材料介导的半导体晶圆键合。上转换是将长波长光转换为短波长的过程，有望应用于各种光电器件。利用嵌入上翻纳米颗粒的粘性有机基质，实现了具有高导电性和赋予界面光学性质的键合。该方法有望应用于多结太阳能电池。

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Upconversion Material-Mediated Semiconductor Bonding

Semiconductor wafer bonding, mediated by upconversion materials, is proposed and demonstrated. Upconversion is a process that converts long wavelength light into short wavelength light, and is expected to be applied to a variety of optoelectronic devices. Bonding with high electrical conductivity and imparting optical properties to the interface is realized by utilizing an adhesive viscous organic matrix with embedded upcinversiion nanoparticles. The application of this method to multijunction solar cells is expected.

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2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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