Delamination Analysis of Stacked Via in High-Density Multilayer Printed Wiring Boards by FEA

Abstract

The effects of structural factors on the delamination of the stacked via in high-density multilayer printed wiring boards were investigated by a statistical approach. Although reducing the height of via or the number of via stacks is effective to prevent the delamination, if these cannot be reduced, the risk of the delamination is eased by increasing the pitch of the stacked via.