Sn-Ag-Cu模具连接接头疲劳裂纹网络的有限元再现分析

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598392

Hiroki Kanai, Y. Kariya, Yoshiki Abe, Y. Yokoyama, Koki Ochi, Ryuichiro Hanada, S. Izuo

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引用次数: 0

摘要

实验观察了Sn-Ag-Cu模具连接接头疲劳裂纹网络的形成过程，并基于logistic函数描述的裂纹起裂规律和Paris型疲劳裂纹扩展规律进行了有限元分析。

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Reproduction Analysis of Fatigue Crack Networks in Sn-Ag-Cu Die Attach Joint by FEA

The formation process of fatigue crack networks in Sn-Ag-Cu die attach joint was experimentally observed, and reproduced by the Finite Element method Analysis (FEA) based on a crack initiation rule described by the logistic function and Paris type fatigue crack propagation law.

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2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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