LNOI photonics fabricated on Si wafer by room temperature bonding

Kaname Watanabe, Yuya Yamaguchi, A. Kanno, R. Takigawa
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Abstract

Room temperature bonding is essential for wafer-level heterogeneous integration of LiNbO3-on-insulator (LNOI) photonics to Si. This paper reports first demonstration of thin film LNOI optical modulator arrays fabricated on Si wafer by room-temperature wafer bonding with Si nanoadhesive layer.
室温键合在硅片上制备LNOI光子学
室温键合对于LiNbO3-on-insulator (LNOI)光子学与Si的晶圆级非均质集成是必不可少的。本文首次在硅片上用硅纳米胶粘剂层室温键合制备了薄膜LNOI光调制器阵列。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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