基于非平面直接键合的混合光学元件

2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2021-10-05 DOI:10.1109/LTB-3D53950.2021.9598402

P. Birckigt, C. Rothhardt, S. Risse, U. Zeitner

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引用次数: 1

摘要

在这里，我们解决了平面晶圆不适合在非平面基板上直接键合的范例。在此过程中，我们还提出了一种测量界面表面能的新方法。这产生了制造结合不同光学特性的新型光学元件的第一个指导方针。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Towards Hybrid Optical Components via Non-Planar Direct Bonding

Here, we tackle the paradigm that direct bonding of planar wafers is not suitable on non-planar substrates. In doing so, we also present a new method for measuring the interface surface energy. This yields first guidelines for manufacturing novel optical components which combine different optical properties.

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2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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