Zhilin Sun, Weifeng Sun, Y. Yi, Chang Chen, W. Yao, Zhenxiong Peng, Longxing Shi
{"title":"PDP scan driver with NVDMOS and RESURF PLDMOS","authors":"Zhilin Sun, Weifeng Sun, Y. Yi, Chang Chen, W. Yao, Zhenxiong Peng, Longxing Shi","doi":"10.1109/ISPSD.2005.1487973","DOIUrl":"https://doi.org/10.1109/ISPSD.2005.1487973","url":null,"abstract":"A high voltage CMOS IC technology by using 25/spl mu/m thick epitaxy based on 1.2/spl mu/m standard CMOS process has been developed. In this technology, LDMOS and VDMOS are fabricated together. Junction isolation is used to isolate VDMOS from LDMOS, low voltage CMOS, and other VDMOSs. Test results show that the rise time and the fall time of the output stage is about 45ns and 50ns, respectively. For the simplicity of the technology, the cost is saved.","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115359407","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Y. Sugawara, K. Asano, S. Ogata, A. Agarwal, S. Ryu, J. Palmour, S. Okada, Y. Miyanagi
{"title":"4.5 kV 60A SICGT and its Half Bridge Inverter Operation of 20kVA Class","authors":"Y. Sugawara, K. Asano, S. Ogata, A. Agarwal, S. Ryu, J. Palmour, S. Okada, Y. Miyanagi","doi":"10.1109/ISPSD.2005.1488009","DOIUrl":"https://doi.org/10.1109/ISPSD.2005.1488009","url":null,"abstract":"4.5kV 60A SICGT of 6mm times 6mm chip size has been developed, which has the largest electric power handling capability among the reported SiC switching devices. Due to the fast turn-on time of 0.08mus and the fast turn-off time of 2.3mus at 250degC, SICGT can realize a low power loss as compared with 4.5kV Si GTOs and 4.5W Si IGBTs. A PWM half bridge inverter was built by using a couple of SICGT modules. Each module consists of one SICGT and two SiC pn diodes in a TO3 type package. The inverter achieved an output power of 20 kVA at V DC of 2kV and carrier frequency of 2kHz, This represents the largest output power among the reported SiC inverters","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128777925","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Munaf T. A. Rahimo, A. Kopta, S. Eicher, U. Schlapbach, S. Linder
{"title":"A study of switching-self-clamping-mode \"SSCM\" as an over-voltage protection feature in high voltage IGBTs","authors":"Munaf T. A. Rahimo, A. Kopta, S. Eicher, U. Schlapbach, S. Linder","doi":"10.1109/ISPSD.2005.1487952","DOIUrl":"https://doi.org/10.1109/ISPSD.2005.1487952","url":null,"abstract":"In this paper, we study the switching-self-clamping-mode \"SSCM\" in high voltage IGBTs in terms of device physics and circuit operation. We present analysis for the HV-IGBT failure mode when operating in SSCM due to an unstable negatively damped system and the design consideration taken into account for avoiding such mode of operation. This enables the introduction of an over-voltage protection feature during device turn-off to add to the existing over-current protection capability under short circuit conditions.","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124569348","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"High performance superjunction UMOSFETs with split p-columns fabricated by multi-ion-implantations","authors":"Y. Miura, H. Ninomiya, K. Kobayashi","doi":"10.1109/ISPSD.2005.1487945","DOIUrl":"https://doi.org/10.1109/ISPSD.2005.1487945","url":null,"abstract":"We propose superjunction UMOSFET devices (SJ-UMOS) with split p-column structures for automotive applications with rated voltage of 40-75 V. The split p-column fabricated by multi-ion-implantations consists of p-type islands separated by small distances in an n-type epi-layer. This structure was designed to improve the repetitive inductive switching performance without sacrificing the original benefits of the SJ structure. We achieved a specific on-resistance of 28.7 m/spl Omega/mm/sup 2/ at a gate voltage of 10 V for breakdown voltage of 68.0 V. In addition, we confirmed high immunity against inductive switching stress at 175/spl deg/C and good reverse recovery properties.","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"86 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121931914","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Das, B. Hull, J. Richmond, B. Heath, J. Sumakeris, A. Powell
{"title":"Ultra High Power 10 kV, 50 A SiC PiN Diodes","authors":"M. Das, B. Hull, J. Richmond, B. Heath, J. Sumakeris, A. Powell","doi":"10.1109/ISPSD.2005.1488010","DOIUrl":"https://doi.org/10.1109/ISPSD.2005.1488010","url":null,"abstract":"Ultra high power 10 kV, 50 A SiC PiN diodes have been developed with a low forward voltage drop (VF) of 3.75 V and a fast reverse recovery time of 150 nsec. This is the highest reported power rating for a single SiC chip (dimensions: 8.7 mm times 8.7 mm). Furthermore, all of the historical problems with the SiC PiN diode technology such as ineffective edge termination (VBD increased to > 70% of ideal breakdown voltage), poor ohmic contacts to p-type SiC (rhoc reduced to < 10-4 Omegacm2), and forward voltage drift (DeltaVF reduced to < 0.1 V) have been solved with design, material, and process improvements which have resulted in high overall device yields. A combination of performance, reliability, and yield has the SiC PiN diode technology poised for a revolutionary impact in the world of power semiconductor devices","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134121562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
W. Saito, I. Omura, S. Aida, S. Koduki, M. Izumisawa, H. Yoshioka, T. Ogura
{"title":"Over 1000V semi-superjunction MOSFET with ultra-low on-resistance below the Si-limit","authors":"W. Saito, I. Omura, S. Aida, S. Koduki, M. Izumisawa, H. Yoshioka, T. Ogura","doi":"10.1109/ISPSD.2005.1487942","DOIUrl":"https://doi.org/10.1109/ISPSD.2005.1487942","url":null,"abstract":"Si-MOSFETs with the breakdown voltage of over 1000 V were demonstrated, for the first time, realizing low on-resistance below the theoretical Si-limit. The fabricated MOSFETs have semi-superjunction (SemiSJ) structure, which is the combination of superjunction (SJ) structure and n-bottom assisted layer (BAL). The SemiSJ MOSFETs realize both the high breakdown voltage of 1100 and 1400 V and the low on-resistance of 54 and 163 m/spl Omega/cm/sup 2/, respectively. The fabrication process for the high voltage SemiSJ-MOSFET was completely equivalent to a 600-V class SJ-MOSFET process, which implies that a single optimized process for forming SJ structure for 600 V-class MOSFET can be used for a wide voltage range extending up to 1200 V MOSFET. These results show the possibility of new Si power-MOSFET with higher application voltage range.","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"88 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134253323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Annese, S. Bertaiola, G. Croce, A. Milani, R. Roggero, P. Galbiati, C. Contiero
{"title":"0.18 μm BCD -High Voltage Gate (HVG) Process to address Advanced Display Drivers Roadmap","authors":"M. Annese, S. Bertaiola, G. Croce, A. Milani, R. Roggero, P. Galbiati, C. Contiero","doi":"10.1109/ISPSD.2005.1488026","DOIUrl":"https://doi.org/10.1109/ISPSD.2005.1488026","url":null,"abstract":"This paper describes BCD-HVG8 (High Voltage Gate) process family, a technology optimized to address the small size display driver applications. 20/32/40V devices with thick gate oxide (Vgs max=25V) have been successfully integrated in a 0.18µm BCD platform. Thanks to its flexibility and modularity, the obtained process is suitable to cover the design requirements coming from all of the present different display realization techniques: passive Liquid Crystal Display (LCD), Thin Film Transistors (TFT) or Organic Light Emission Diodes (OLED).","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130856710","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A novel drift region self-aligned SOI power MOSFET using a partial exposure technique","authors":"L. Guan, J. Sin, Zhibin Xiong, Haitao Liu","doi":"10.1109/ISPSD.2005.1487978","DOIUrl":"https://doi.org/10.1109/ISPSD.2005.1487978","url":null,"abstract":"In this paper, a novel drift region self-aligned SOI power MOSFET using a partial exposure technique is proposed and demonstrated. The drift region is self-aligned to the channel and was achieved using a simple process without the need of an additional mask. Furthermore, the drift length can be controlled conveniently using different layout designs with a length ranging from 0.3/spl mu/m to a few microns. The fabricated SOI power device has a breakdown voltage of over 20V. Using a 0.7/spl mu/m non-silicide technology, the cutoff frequency (f/sub t/) and maximum oscillation frequency (f/sub max/) of the device are 10.1 GHz and 13.7GHz, respectively.","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131141205","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Degraded blocking performance of 4H-SiC rectifiers under high dV/dt conditions","authors":"P. Losee, L. Zhu, T. Chow, I. Bhat, R. Gutmann","doi":"10.1109/ISPSD.2005.1487990","DOIUrl":"https://doi.org/10.1109/ISPSD.2005.1487990","url":null,"abstract":"We present our pulsed blocking measurements of co-fabricated 4H-SiC Schottky, junction barrier Schottky (JBS), and pin diodes. Schottky diodes fail at pulsed voltages noticeably lower than their static values, while the pulsed leakage currents of JBS and pin diodes (along with commercial SiC rectifiers) remain below our measurable limits until the reverse voltage approaches the static breakdown. From experimental results and numerical simulations, the premature breakdown of the diodes is attributed to the slow response of deep levels associated with dopant implantation, which can leave high field points such as the edge of contacts unprotected under high dV/dt blocking conditions.","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133807759","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"High speed lateral-IGBT with a passive gate","authors":"T. Terashima, J. Moritani","doi":"10.1109/ISPSD.2005.1487958","DOIUrl":"https://doi.org/10.1109/ISPSD.2005.1487958","url":null,"abstract":"A lateral-IGBT with a passive gate on collector portion has been proposed. Since the collector voltage directly drives the passive gate which controls the parasitic PNPTr, high-speed turn-off is compatible with low on-resistance without a side effect such as snapback I-V characteristics. Simulation results have shown drastic drop of fall time from 120ns to 5ns. Fabricated device have realize 6.8 ohm/mm/sup 2/ @ Kc=2V specific on-resistance, 780V blocking capability and improved turn-off characteristics similar to simulation results.","PeriodicalId":154808,"journal":{"name":"Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.","volume":"234 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114534219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}