2020 21st International Conference on Electronic Packaging Technology (ICEPT)最新文献

{"title":"Process development of Large Size Embedded Silicon Fan-out (eSiFO) Package","authors":"X. Gu, Shuying Ma, Jiao Wang, Y. Hao","doi":"10.1109/ICEPT50128.2020.9202937","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202937","url":null,"abstract":"With the development of new technologies such as IoT, 5G, AI&VR, automotive electronics, the urgent demand of high density, multichip integration packaging technology is increasing strongly. Fan-out technology has attracted much more attentions as a new advanced technology and grown explosively. The market scale of fan-out packaging is expected to grow to 3.8 billion US dollars with a CAGR of 19% in the next few years. In this paper, one package in a size of 20×20 mm and containing a 14×14mm large embedded die was successfully manufactured. Various key process such as cavity etching, die attach, vacuum lamination were developed. A test vehicle composed of several electrical measurement structures was designed with three different thicknesses: 70 um, 80 um and 90 um, which respectively realize different package thickness. In the test vehicles, daisy chains and other test units were established to measure electricity performance.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114862791","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Flexible Discrete Passive Filter with Minor Strain Suffering","authors":"Xiaodong Yang, Liwei Zhao, Zixuan You, Guoxuan Qin","doi":"10.1109/ICEPT50128.2020.9202858","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202858","url":null,"abstract":"This paper proposes a flexible passive filter and summarizes the design rules of a flexible filter from the perspective of physical design methods. Compared with the filter design method of lumped structure, the distributed structure can reduce the effect of stress and transfer the stress of flexible deformation from the device itself to the substrate, and under a certain range of stress, the device can maintain good performance. In this paper, the above viewpoints are well verified by simulation experiments. A distributed structure is used to design the passive filter, which reduces the stress damage and stress induced performance impact of the device, and provides theoretical guidance for enhancing the reliability design of the flexible filter.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124122904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Antenna on board package for 5G millimeter wave phased array antenna","authors":"Liu Jihao","doi":"10.1109/ICEPT50128.2020.9202652","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202652","url":null,"abstract":"In order to meet the needs of 5G communication, 5G millimeter wave phased array antenna vehicle components are developed. The traditional phased array antenna technology is mostly based on the building block transceiver or tile transceiver module of discrete devices. Using traditional MCM technology, it is difficult to realize thin, homomorphic and modular phased array antenna due to its complex process, high cost and large thickness. Therefore, simplifying the topology of phased array antenna and realizing thinning and modularization are the main trends of phased array antenna development. The highly integrated 64 element active antenna integrates 64 element broadband array antenna, microwave feed network, wave control network and power supply network with high integration. The millimeter wave active phased array antenna module developed for 5g millimeter wave communication is innovative and unique. Multi functional antenna board is used to integrate antenna array, feed network, power supply network and wave control network. Silicon based multi-functional transceiver chip is used to integrate transceiver channel, simplify antenna transceiver link, reduce antenna thickness, improve antenna productivity and reduce antenna loss. Antenna cost meets the requirements of high integration, modularization, easy assembly, low cost and strong scalability, and can meet the requirements of 5g millimetre The demand of meter wave communication.The on-board antenna is in the form of microstrip antenna. The whole on-board microstrip antenna consists of seven layers. It is fed by a stripline and coupled to the main patch antenna through an H-shaped through-hole. A layer of dielectric and parasitic patch antenna are added to the upper layer of the main patch antenna, which can expand the bandwidth to meet the requirement of 5g broadband. The feed network is a signal synthesis network that provides beamforming for the on-board phased array antenna. The feeding network adopts the structure of Wilkinson power divider with stripline, which has the advantages of miniaturization, lightweight and high reliability.The millimeter wave phased array antenna on board is tested. The results show that the normalized emission scanning pattern has good pattern characteristics in the range of ± 45 degrees, and the side lobe level is lower than - 12dB. The EIRP value is greater than 51 dBm. In the range of ± 45 degrees, the cross polarization isolation of on board phased array antenna is better than -30 dB. The test results of 5G millimeter wave phased array antenna for broadband communication show that the data transmission rate is more than 2.8Gbps when the bandwidth is 800MHz and the modulation mode is 64QAM. At the same time, high integration millimeter wave communication active phased array antenna can also be used in satellite communication, tactical mobile hot spots and other fields.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126505941","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation of reliability and security of the 3D packaging structure","authors":"Chunsheng Zhu, Yingjian Yan, Pengfei Guo","doi":"10.1109/ICEPT50128.2020.9202416","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202416","url":null,"abstract":"Security of chips is the cornerstone of the hardware security and has drawn significant attention. With booming development of advanced packaging, it has provided a new approach to protect chips and the concept of \"security packaging of ICs\" has been proposed recently. In this paper, security packaging of chips was fully investigated. And, then, our attention was paid on 3D packaging, which offers many new opportunities to chip security mechanism. Additionally, reliability is an important concern in 3D packaging and has inherent relationship with security design. Therefore, reliability and security were discussed together and treated in a holistic manner. To be specific, the reliability and security property of the power distribution network (PND) of 3D packaging was investigated and verified by experiment.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121602898","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"An Antenna in Package for 5G mmWave Application","authors":"Zebin Chen, Jun Zhang, Zhuozhu Chen, Bo Sun, Sha Xu, Chunbing Guo","doi":"10.1109/ICEPT50128.2020.9202480","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202480","url":null,"abstract":"The interconnection loss between the chip and antenna in the millimeter(mm)-wave band becomes a challenge for system integration, fabrication, and testing, requiring a joint design in the material, circuit, packaging, and radiation. In this paper, from the electromagnetic perspective of view, antenna on chip, antenna in package, and the hybrid solution will be compared in loss and impedance matching. After that, we present a low-cost antenna operating at the mm-wave band. To reduce the interconnection loss, the electromagnetic coupling is selected instead of lead connection. The proposed antenna can achieve an impedance bandwidth of 29.1%, ranging from 25.5~34.2 GHz with a peak realized gain of 6.14 dBi, which can be applicable for 5G communication.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131927682","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The Analysis of the Structural Dynamic Characteristics in Board Packaging Structure and Its Test Technology Research","authors":"Jun Tong, Chuantao Hou, Yueping Zhang","doi":"10.1109/ICEPT50128.2020.9202462","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202462","url":null,"abstract":"In the mechanical environment, the most likely mechanical elements of electronic equipment’s failure are the leads and solder joints of electronic equipment. Because in electronic packaging products, the numbers of leads and solder joints is large and the volume is small, with large scale and large cross domain to electronic board, it is unwise to set a unified model. This paper puts forward a crossed scale modeling method and a model modification method based on parameter sensitivity analysis. At last the fine modeling of the span from 0.05mm rubber thickness to 100mm plate radius is realized by many equivalent modeling technologies, which are fine modeling of solid elements being adopted for the key parts such as solder joints and leads, using shell element equivalent to circuit board, at the same time, setting a transition mesh in the connection area of the shell cell, and the connection between shell element and body element realized by using body shell element degree of freedom matching technology, local grid refinement technology and the matching technology of the degree of freedom of body shell element. Finally, the modal test is carried out by the optical modal test technology, and the simulation model is modified. The methods proposed in this paper have good engineering application value and can be used to analyze the stress level of solder joints and leads of packaging devices under vibration and impact environment.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"216 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130133040","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Design, Fabrication and Measurement of Micro-Bumps Array for RF Application","authors":"Yuchi Yang, J. Chen, Wei Wang, Mengcheng Wang, Shengli Ma, Liu-lin Hu, Shuwei He","doi":"10.1109/ICEPT50128.2020.9202930","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202930","url":null,"abstract":"In recent years, radio frequency (RF) systems have been moving towards miniaturization. Traditional wire-bonding technology used in RF systems have significant disadvantages in terms of parametric inductance and package size scaling-down. Therefore, people pay more attention to the high-performance and small-size interconnection schemes of RF systems. In this regard, we designed a series of micro bumps arrays for RF application, including arrays with diameters of 15 μm / 30 μm / 40 μm and a pitch of 30 μm / 60 μm / 80 μm. To study RF property of micro bumps array, Cu / Sn micro bumps arrays jointed double-layer coplanar waveguide (CPW) structures were prepared and tested. By subtracting the insertion loss of CPW line from the test structure's insertion loss, the insertion loss of the micro bumps array can be obtained. Comparing the insertion loss of micro bumps arrays with different diameters, the insertion loss of the micro-bumps array with a diameter of 15 μm is the smallest, and the micro bumps with multiple rows have lower insertion loss than a single micro bump. Among them, the insertion loss of a 3 × 6 micro bumps array with a diameter of 15 μm after bonding is 0.15 dB@40GHz.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130458554","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Gallium Nitride Dual Two - Dimensional Electron Gas HEMT with a Good Performance: Based on TCAD simulations","authors":"Xu Zhang, Liming Wang, Wanjie Li, Luqi Tao, Xianping Chen","doi":"10.1109/ICEPT50128.2020.9202882","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202882","url":null,"abstract":"A gallium nitride (GaN) dual two - dimensional electron gas based high electron mobility transistor (D2DEGHEMT) is proposed and investigated based on TCAD simulations. According to the emulation, transfer characteristics curve and gate-source capacitance characteristic demonstrate that the GaN D2DEG-HEMT realizes normally-off feature with a threshold voltage of +4V. Besides, the off-state breakdown characteristics and Idrain-Vdrain output characteristics for the GaN D2DEG-HEMT and common GaN recessed gate MISHEMT (RG-MISHEMT) are also simulated. Results prove that the proposed GaN D2DEGHEMT has higher off-state breakdown voltage (465V, Lgd=2μm) and saturation current (above 1.5A/mm, Vgate=10V) comparing with the common GaN RG-MISHEMT under the same device size. Higher power density and wafer utilization are achieved in GaN D2DEG-HEMT.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131215837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Investigation on a miniaturized X-band transceiver front-end in a cost-effective SiP solution","authors":"Y. Ban, Jie Liu","doi":"10.1109/ICEPT50128.2020.9202596","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202596","url":null,"abstract":"This paper presents a feasible and efficient implementation of a miniaturized X-band transceiver front-end in a cost-effective system-in-package (SiP) technology. Integrating multiple radio-frequency (RF) GaAs / GaN dies with land grid array (LGA) packages is one of the most commonly used solutions in wireless application. Meanwhile, incorporating the RF power devices with quad flat no-lead (QFN) package is a promising substitute due to good thermal conductivity, which utilizes a large die pad in the center which directly transfers the heat from the GaAs / GaN dies from the package to the outside. In this work, an integrated X-band transceiver is designed and implemented with the LGA and QFN technology, respectively. Subsequently, an overall system-level performance investigation and comparison has been analyzed and illustrated. Moreover, the detailed thermal-electrical / thermal-mechanical analysis and comparison are presented in this paper. According to the simulation results, the proposed SiP layout achieves good power performance and reliability with acceptable costs. Finally, the 8-12GHz transceiver is respectively implemented in a QFN and LGA technology, achieving a similar performance and specification. The total package size of the X-band transceiver is slightly different, which is 9*12 mm2 (QFN) and 11*14 mm2 (LGA).","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130918319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Lightweight and Flexible Fe3O4/MXene/Cellulose Nanofiber Film with Gradient and Sandwich Structure for Superior EMI Shielding Properties","authors":"Xingmiao Li, Xiao-Yun Wang, Siyuan Liao, Y. Wan, Pengli Zhu, R. Sun","doi":"10.1109/ICEPT50128.2020.9202866","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202866","url":null,"abstract":"Nowadays, electronic equipment and wireless communication equipment are widely used，it is necessary to prepare various EMI shielding materials to eliminate the radiation pollution. In this study, a lightweight and flexible Fe3O4/MXene/cellulose nanofiber composite film was developed. The composite film exhibits a strong mechanical strength of 20.5 MPa. Particularly, owing to the combination of magnetic nanoparticles and two-dimensional MXenes with superb electrical conductivity, the EMI SE of the film reached 35 dB. Adding magnetic Fe3O4 nanoparticles on the top layer of sandwich structure improves the EMI SE via increasing the value of the absorption loss, and MXene/CNF layers with different content gradients are superposed to enhance the loss of incident electromagnetic wave. The design and fabrication of Fe3O4/MXene/cellulose nanofiber composite film provide an environmental-friendly and facile method for EMI shielding materials, which broaden the applications of MXene-based composite materials.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132999130","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}