Gallium Nitride Dual Two - Dimensional Electron Gas HEMT with a Good Performance: Based on TCAD simulations

Xu Zhang, Liming Wang, Wanjie Li, Luqi Tao, Xianping Chen
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引用次数: 1

Abstract

A gallium nitride (GaN) dual two - dimensional electron gas based high electron mobility transistor (D2DEGHEMT) is proposed and investigated based on TCAD simulations. According to the emulation, transfer characteristics curve and gate-source capacitance characteristic demonstrate that the GaN D2DEG-HEMT realizes normally-off feature with a threshold voltage of +4V. Besides, the off-state breakdown characteristics and Idrain-Vdrain output characteristics for the GaN D2DEG-HEMT and common GaN recessed gate MISHEMT (RG-MISHEMT) are also simulated. Results prove that the proposed GaN D2DEGHEMT has higher off-state breakdown voltage (465V, Lgd=2μm) and saturation current (above 1.5A/mm, Vgate=10V) comparing with the common GaN RG-MISHEMT under the same device size. Higher power density and wafer utilization are achieved in GaN D2DEG-HEMT.
性能优良的氮化镓双二维电子气体HEMT:基于TCAD仿真
提出并研究了一种氮化镓(GaN)双二维电子气基高电子迁移率晶体管(D2DEGHEMT)。仿真结果表明,GaN D2DEG-HEMT在+4V的阈值电压下实现了正常关断特性。此外,还模拟了GaN D2DEG-HEMT和普通GaN凹槽门MISHEMT (RG-MISHEMT)的脱态击穿特性和漏极-电压漏极输出特性。结果表明,在相同器件尺寸下,与普通GaN RG-MISHEMT相比,本文提出的GaN D2DEGHEMT具有更高的断态击穿电压(465V, Lgd=2μm)和饱和电流(大于1.5A/mm, Vgate=10V)。GaN D2DEG-HEMT实现了更高的功率密度和晶圆利用率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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