2020 21st International Conference on Electronic Packaging Technology (ICEPT)最新文献

Versatile TIM Solution with Chain Network Solder Composite 多用途的TIM解决方案与链网焊料复合

2020 21st International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2020-08-01 DOI: 10.1109/ICEPT50128.2020.9202914

R. Mao, Sihai Chen, E. Zito, David Bedner, N. Lee

{"title":"Versatile TIM Solution with Chain Network Solder Composite","authors":"R. Mao, Sihai Chen, E. Zito, David Bedner, N. Lee","doi":"10.1109/ICEPT50128.2020.9202914","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202914","url":null,"abstract":"A novel epoxy-based SAC solder paste TIM system has been developed with the use of non-volatile epoxy flux. A Cu filler was added to the solder paste, with the Cu volume % of metal ranged from 17 to 60 volume % of metal. Formation of semicontinuous high-melting Cu chain network was achieved, with Cu particles bridged by the CuSn IMC. This chain network, at sufficient concentration, serves as a skeleton and maintains the shape of the sandwiched solder paste layer, thus preventing further spread out at subsequent SMT reflow process, and also allowing formation of the TIM joint, even in the absence of solderable metallization on flip-chip and packaging housing. This chain network hampered the flow of liquid solder, and thus restrained the expansion of outgassing, and consequently resulted in low voiding. Existence of crevices was attributed to excessive oxide brought in by Cu particles and appeared to increase with increasing Cu filler content. The presence of ductile solder within the TIM joint promises high resistance against brittle cracking under stress. The Cu content could be further optimized between 17 and 60 volume % of metal to (1) avoid flux bleeding, (2) maintain good epoxy adhesion between TIM phase and parts, and (3) to retain ductile solder phase. The 20°C thermal conductivity achieved was 6.1 W/mK and could be up to about 13 W/mK with further epoxy flux optimization.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116789352","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Preparetion and properties of SiO2 filled underfills with controllable chemical groups on the surface of filler 表面化学基团可控的SiO2底填料的制备及性能研究

2020 21st International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2020-08-01 DOI: 10.1109/ICEPT50128.2020.9202941

Chao Zhang, Yuanyuan Yang, Gang Li, Pengli Zhu, Tingxi Li, R. Sun

{"title":"Preparetion and properties of SiO2 filled underfills with controllable chemical groups on the surface of filler","authors":"Chao Zhang, Yuanyuan Yang, Gang Li, Pengli Zhu, Tingxi Li, R. Sun","doi":"10.1109/ICEPT50128.2020.9202941","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202941","url":null,"abstract":"With the miniaturization of electronic packages, the flip-chip gap has become smaller, and the SiO2 with very small particle size has been used as filler for underfill. The volume fraction of interfacial phase increases with the decrease of the size of SiO2. The control of the chemical groups on the silica surface has an important influence on the overall properties of underfill, for instance, processing fluidity, rheological behavior, thermomechanical properties, coefficient of thermal expansion (CTE), storage modulus, loss modulus, curing time, curing temperature, adhesive strength, etc. Here, we control the groups on the surface of SiO2 by changing the reaction conditions of two kinds of silane coupling agents. One of the modification methods is to use an acid as a catalyst in an aqueous alcohol solution to hydrolyze and graft the silane coupling agent onto the surface of silica. Another method is to directly modify the silica by using a silane coupling agent as a solution. Compared with in the presence of water, the silane coupling agent-modified silica reduces the hydroxyl groups on the silica surface more obviously under anhydrous conditions, which is better for the viscosity reduction and viscosity stability increase of underfill.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117153935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Failure Analysis on Packaging Materials Fault for Plastic package IC 塑料封装IC封装材料故障分析

2020 21st International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2020-08-01 DOI: 10.1109/ICEPT50128.2020.9202963

Zhe Sun, Weiguan Huang, Zhenfeng Xie

引用次数: 0

Synthesis of bimodal silver nanoparticles for inkjet-printed flexible electronics with excellent stretchability 具有优异拉伸性的喷墨印刷柔性电子器件用双峰银纳米粒子的合成

2020 21st International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2020-08-01 DOI: 10.1109/ICEPT50128.2020.9202995

C. Wei, Xinling Xu, Qi Zhou, H. Cao, Zhihao Zhang

引用次数: 0

Dynamical Frequency Displacement Scheme for Fault-tolerant LLC Topology 容错LLC拓扑的动态频率位移方案

2020 21st International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2020-08-01 DOI: 10.1109/ICEPT50128.2020.9201928

Chi Man Cheng, Tak Lok Shum, Shek Mong Wong

引用次数: 0

Investigation on failures of plastic package devices with unidentifiable defects related to deficient molding process 塑料封装器件因成型工艺缺陷导致的无法识别缺陷的失效调查

2020 21st International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2020-08-01 DOI: 10.1109/ICEPT50128.2020.9202908

Jinbao Cai, Wei Li, Xuanlong Chen, Hongqin Wang, Sheng-zong He

引用次数: 0

Study on the Differential Impedance Routing in FC Ceramic Package FC陶瓷封装差分阻抗布线研究

2020 21st International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2020-08-01 DOI: 10.1109/ICEPT50128.2020.9202973

Xiao-jun Zhang, Ling Gao, Lili Cheng

引用次数: 0

Life Prediction and Verification of Energy Meter Based on Multi-stress Influence Weibull Distribution Model 基于多应力影响威布尔分布模型的电能表寿命预测与验证

2020 21st International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2020-08-01 DOI: 10.1109/ICEPT50128.2020.9202443

Jiangming Zhang, L. Yao, Jifan Lv, L. Ni, Jian Yuan, Yingjun Hu

{"title":"Life Prediction and Verification of Energy Meter Based on Multi-stress Influence Weibull Distribution Model","authors":"Jiangming Zhang, L. Yao, Jifan Lv, L. Ni, Jian Yuan, Yingjun Hu","doi":"10.1109/ICEPT50128.2020.9202443","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202443","url":null,"abstract":"Generally, the failure distribution characteristics of different failure modes are different, and the stress types and degradation processes that induce their failures also differ. This paper proposes a method for predicting the life of electric energy meter based on Multi-stress influence Weibull distribution model. The stress types mainly include environmental stress and electrical stress. Using historical fault data of electric energy meter to establish Weibull distribution model of failure rate of each failure mode, and then for the main types of influence stress, establish a model between the influence stress and failure rate of each failure mode, and calculate the influence coefficient. The short-term life of the overall energy meter is obtained by adjusting the failure rate at the predicted stage of each failure mode. By verifying the field actual energy meter fault data, showing that the method can effectively predict the life of the energy meter, and provide technical support for energy meter status replacement, and fault early warning.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122899658","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Simulation and Experimental Study of the Temperature Field of Solder Ball in the Nozzle during Laser Jet Solder Ball Bonding Process 激光喷射焊球焊接过程中喷嘴内焊球温度场的仿真与实验研究

2020 21st International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2020-08-01 DOI: 10.1109/ICEPT50128.2020.9203003

Tong Li, K. Pan, Zhengdong Tan, Yunfeng Cai, Tianjie Teng, Yixuan Li

{"title":"Simulation and Experimental Study of the Temperature Field of Solder Ball in the Nozzle during Laser Jet Solder Ball Bonding Process","authors":"Tong Li, K. Pan, Zhengdong Tan, Yunfeng Cai, Tianjie Teng, Yixuan Li","doi":"10.1109/ICEPT50128.2020.9203003","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9203003","url":null,"abstract":"With the development of the electronics industry, traditional integrated heating soldering modes such as wave soldering and hot air reflow soldering cannot meet the needs of engineering in the face of photoelectric interconnection module, three-dimensional assembly, and 5 G optical communication modules as well as heat-sensitive components. At this time, the laser jet solder ball bonding process has more and more applications in the engineering field due to its high energy density and local heating. Because the temperature field of the entire laser jet solder ball bonding is a highly transient process, which is different from the traditional soldering temperature field, and the temperature of the soldering is very important to the quality of the solder joint. Therefore, it is important to see that the temperature change of the solder balls when it is heated in the nozzle to ensure the formation of a good solder joint. To solve this problem, the finite element simulation and the experimental method are used to study the heating temperature field of the solder ball in the nozzle. In the simulation, the transient thermal method was used to analyze the transient temperature distribution of the solder ball in the nozzle. In this experiment, the temperature change of the solder ball in the nozzle was recorded by an infrared thermometer. The simulation results show that when the solder ball is heated by the laser in the nozzle, the effective power of the laser has a significant impact on the temperature field of the solder ball, and the nozzle has an important impact on the melting of the solder ball. The experimental results show that the temperature change of the heated solder ball in the nozzle is similar to the simulation results, which verify the validity of the model and the reliability of the simulation results. It is of significance to guide the temperature field control in the actual soldering process.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"276 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123030368","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Flexible Film Heater Fabricated by Optimized PEDOT:PSS-GO/AgNW Composite Transparent Conductive Film with Enhanced Water Resistance 优化PEDOT:PSS-GO/AgNW复合透明导电膜制备柔性薄膜加热器

2020 21st International Conference on Electronic Packaging Technology (ICEPT) Pub Date : 2020-08-01 DOI: 10.1109/ICEPT50128.2020.9202551

Kaiqing Wang, Xiaocun Wang, Jianzhong Wang, F. Xiao

{"title":"Flexible Film Heater Fabricated by Optimized PEDOT:PSS-GO/AgNW Composite Transparent Conductive Film with Enhanced Water Resistance","authors":"Kaiqing Wang, Xiaocun Wang, Jianzhong Wang, F. Xiao","doi":"10.1109/ICEPT50128.2020.9202551","DOIUrl":"https://doi.org/10.1109/ICEPT50128.2020.9202551","url":null,"abstract":"Silver nanowire (AgNW) network film is transparent conductive material with good potential in flexible electronics. PEDOT:PSS as coating on AgNW film can obviously improve the adhesion, surface smoothness and mechanical flexibility of the film. However, PEDOT:PSS tends to be dissolved in water, and its water absorption and acidity are also detrimental to the stability of the film. In this paper, we mixed PEDOT:PSS solution with graphene oxide (GO) solution, and spin-coated the hybrid on the surface of AgNW film to prepare PEDOT:PSS-GO/AgNW composite film. The transparent conductive composite film exhibits good adhesion on substrate, lower surface roughness, better thermal stability and mechanical flexibility than both AgNW film and PEDOT:PSS/AgNW film. In addition, the PEDOT:PSS-GO layer showed obviously improved water resistance compared to PEDOT:PSS. After being immersed in water for 1 h, the PEDOT:PSS-GO/AgNW film still exhibited good adhesion on substrate, while the PEDOT:PSS/AgNW film showed weak resistant to tape test due to the dissolution of PEDOT:PSS. Flexible film heaters were fabricated based on PEDOT:PSS- GO/AgNW composite film, which exhibited fast response, uniform heat distribution and high temperature at low voltages under bending conditions.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129817900","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0