Failure Analysis on Packaging Materials Fault for Plastic package IC

Abstract

Due to its advantages in terms of cheap cost, simple production process and it can be produced automatically in large numbers, plastic package is adopted in more and more transistors and integrated circuits in recent years. As the "protective coat" of integrated circuits, the reliability of packaging materials directly affects the reliability of integrated circuits. This paper presents an example of integrated circuit failure caused by packaging material. Due to the high content of Na+ and K+ in the packaging material, leakage occurs in the internal of integrated circuit during the use in humid environment, resulting in chip burnout. Hot and humid powered up test is used to reproduce the failure of the integrated circuit, and the failure morphology is highly similar with the market failure.