Study on the Differential Impedance Routing in FC Ceramic Package

Abstract

With the Semiconductor technology developing speedly, micro-electronic products have stepped into highly speed scope.In high reliability application, ceramic packages for filp chip are widely applied. The ceramic packages for high speed signal IC, should have differential impedance routing, to match with IC ports. In this paper, differential impedance of a 1144 pin ceramic land grid package were studied, we built the routing model in package design software firstly, and then simulated the differential impedance of the routing in EM simulation software. Lastly, we tested the differential impedance of the routing,and compared the simulation result and test result. From this study, we can give a beneficial suggestion for the package design of high speed signal FC package device.