Tong Li, K. Pan, Zhengdong Tan, Yunfeng Cai, Tianjie Teng, Yixuan Li
{"title":"激光喷射焊球焊接过程中喷嘴内焊球温度场的仿真与实验研究","authors":"Tong Li, K. Pan, Zhengdong Tan, Yunfeng Cai, Tianjie Teng, Yixuan Li","doi":"10.1109/ICEPT50128.2020.9203003","DOIUrl":null,"url":null,"abstract":"With the development of the electronics industry, traditional integrated heating soldering modes such as wave soldering and hot air reflow soldering cannot meet the needs of engineering in the face of photoelectric interconnection module, three-dimensional assembly, and 5 G optical communication modules as well as heat-sensitive components. At this time, the laser jet solder ball bonding process has more and more applications in the engineering field due to its high energy density and local heating. Because the temperature field of the entire laser jet solder ball bonding is a highly transient process, which is different from the traditional soldering temperature field, and the temperature of the soldering is very important to the quality of the solder joint. Therefore, it is important to see that the temperature change of the solder balls when it is heated in the nozzle to ensure the formation of a good solder joint. To solve this problem, the finite element simulation and the experimental method are used to study the heating temperature field of the solder ball in the nozzle. In the simulation, the transient thermal method was used to analyze the transient temperature distribution of the solder ball in the nozzle. In this experiment, the temperature change of the solder ball in the nozzle was recorded by an infrared thermometer. The simulation results show that when the solder ball is heated by the laser in the nozzle, the effective power of the laser has a significant impact on the temperature field of the solder ball, and the nozzle has an important impact on the melting of the solder ball. The experimental results show that the temperature change of the heated solder ball in the nozzle is similar to the simulation results, which verify the validity of the model and the reliability of the simulation results. It is of significance to guide the temperature field control in the actual soldering process.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"276 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Simulation and Experimental Study of the Temperature Field of Solder Ball in the Nozzle during Laser Jet Solder Ball Bonding Process\",\"authors\":\"Tong Li, K. Pan, Zhengdong Tan, Yunfeng Cai, Tianjie Teng, Yixuan Li\",\"doi\":\"10.1109/ICEPT50128.2020.9203003\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the development of the electronics industry, traditional integrated heating soldering modes such as wave soldering and hot air reflow soldering cannot meet the needs of engineering in the face of photoelectric interconnection module, three-dimensional assembly, and 5 G optical communication modules as well as heat-sensitive components. At this time, the laser jet solder ball bonding process has more and more applications in the engineering field due to its high energy density and local heating. Because the temperature field of the entire laser jet solder ball bonding is a highly transient process, which is different from the traditional soldering temperature field, and the temperature of the soldering is very important to the quality of the solder joint. Therefore, it is important to see that the temperature change of the solder balls when it is heated in the nozzle to ensure the formation of a good solder joint. To solve this problem, the finite element simulation and the experimental method are used to study the heating temperature field of the solder ball in the nozzle. In the simulation, the transient thermal method was used to analyze the transient temperature distribution of the solder ball in the nozzle. In this experiment, the temperature change of the solder ball in the nozzle was recorded by an infrared thermometer. The simulation results show that when the solder ball is heated by the laser in the nozzle, the effective power of the laser has a significant impact on the temperature field of the solder ball, and the nozzle has an important impact on the melting of the solder ball. The experimental results show that the temperature change of the heated solder ball in the nozzle is similar to the simulation results, which verify the validity of the model and the reliability of the simulation results. It is of significance to guide the temperature field control in the actual soldering process.\",\"PeriodicalId\":136777,\"journal\":{\"name\":\"2020 21st International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"276 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 21st International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT50128.2020.9203003\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT50128.2020.9203003","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Simulation and Experimental Study of the Temperature Field of Solder Ball in the Nozzle during Laser Jet Solder Ball Bonding Process
With the development of the electronics industry, traditional integrated heating soldering modes such as wave soldering and hot air reflow soldering cannot meet the needs of engineering in the face of photoelectric interconnection module, three-dimensional assembly, and 5 G optical communication modules as well as heat-sensitive components. At this time, the laser jet solder ball bonding process has more and more applications in the engineering field due to its high energy density and local heating. Because the temperature field of the entire laser jet solder ball bonding is a highly transient process, which is different from the traditional soldering temperature field, and the temperature of the soldering is very important to the quality of the solder joint. Therefore, it is important to see that the temperature change of the solder balls when it is heated in the nozzle to ensure the formation of a good solder joint. To solve this problem, the finite element simulation and the experimental method are used to study the heating temperature field of the solder ball in the nozzle. In the simulation, the transient thermal method was used to analyze the transient temperature distribution of the solder ball in the nozzle. In this experiment, the temperature change of the solder ball in the nozzle was recorded by an infrared thermometer. The simulation results show that when the solder ball is heated by the laser in the nozzle, the effective power of the laser has a significant impact on the temperature field of the solder ball, and the nozzle has an important impact on the melting of the solder ball. The experimental results show that the temperature change of the heated solder ball in the nozzle is similar to the simulation results, which verify the validity of the model and the reliability of the simulation results. It is of significance to guide the temperature field control in the actual soldering process.
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