{"title":"性能优良的氮化镓双二维电子气体HEMT:基于TCAD仿真","authors":"Xu Zhang, Liming Wang, Wanjie Li, Luqi Tao, Xianping Chen","doi":"10.1109/ICEPT50128.2020.9202882","DOIUrl":null,"url":null,"abstract":"A gallium nitride (GaN) dual two - dimensional electron gas based high electron mobility transistor (D2DEGHEMT) is proposed and investigated based on TCAD simulations. According to the emulation, transfer characteristics curve and gate-source capacitance characteristic demonstrate that the GaN D2DEG-HEMT realizes normally-off feature with a threshold voltage of +4V. Besides, the off-state breakdown characteristics and Idrain-Vdrain output characteristics for the GaN D2DEG-HEMT and common GaN recessed gate MISHEMT (RG-MISHEMT) are also simulated. Results prove that the proposed GaN D2DEGHEMT has higher off-state breakdown voltage (465V, Lgd=2μm) and saturation current (above 1.5A/mm, Vgate=10V) comparing with the common GaN RG-MISHEMT under the same device size. Higher power density and wafer utilization are achieved in GaN D2DEG-HEMT.","PeriodicalId":136777,"journal":{"name":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Gallium Nitride Dual Two - Dimensional Electron Gas HEMT with a Good Performance: Based on TCAD simulations\",\"authors\":\"Xu Zhang, Liming Wang, Wanjie Li, Luqi Tao, Xianping Chen\",\"doi\":\"10.1109/ICEPT50128.2020.9202882\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A gallium nitride (GaN) dual two - dimensional electron gas based high electron mobility transistor (D2DEGHEMT) is proposed and investigated based on TCAD simulations. According to the emulation, transfer characteristics curve and gate-source capacitance characteristic demonstrate that the GaN D2DEG-HEMT realizes normally-off feature with a threshold voltage of +4V. Besides, the off-state breakdown characteristics and Idrain-Vdrain output characteristics for the GaN D2DEG-HEMT and common GaN recessed gate MISHEMT (RG-MISHEMT) are also simulated. Results prove that the proposed GaN D2DEGHEMT has higher off-state breakdown voltage (465V, Lgd=2μm) and saturation current (above 1.5A/mm, Vgate=10V) comparing with the common GaN RG-MISHEMT under the same device size. Higher power density and wafer utilization are achieved in GaN D2DEG-HEMT.\",\"PeriodicalId\":136777,\"journal\":{\"name\":\"2020 21st International Conference on Electronic Packaging Technology (ICEPT)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 21st International Conference on Electronic Packaging Technology (ICEPT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT50128.2020.9202882\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 21st International Conference on Electronic Packaging Technology (ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT50128.2020.9202882","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Gallium Nitride Dual Two - Dimensional Electron Gas HEMT with a Good Performance: Based on TCAD simulations
A gallium nitride (GaN) dual two - dimensional electron gas based high electron mobility transistor (D2DEGHEMT) is proposed and investigated based on TCAD simulations. According to the emulation, transfer characteristics curve and gate-source capacitance characteristic demonstrate that the GaN D2DEG-HEMT realizes normally-off feature with a threshold voltage of +4V. Besides, the off-state breakdown characteristics and Idrain-Vdrain output characteristics for the GaN D2DEG-HEMT and common GaN recessed gate MISHEMT (RG-MISHEMT) are also simulated. Results prove that the proposed GaN D2DEGHEMT has higher off-state breakdown voltage (465V, Lgd=2μm) and saturation current (above 1.5A/mm, Vgate=10V) comparing with the common GaN RG-MISHEMT under the same device size. Higher power density and wafer utilization are achieved in GaN D2DEG-HEMT.