An Antenna in Package for 5G mmWave Application

Abstract

The interconnection loss between the chip and antenna in the millimeter(mm)-wave band becomes a challenge for system integration, fabrication, and testing, requiring a joint design in the material, circuit, packaging, and radiation. In this paper, from the electromagnetic perspective of view, antenna on chip, antenna in package, and the hybrid solution will be compared in loss and impedance matching. After that, we present a low-cost antenna operating at the mm-wave band. To reduce the interconnection loss, the electromagnetic coupling is selected instead of lead connection. The proposed antenna can achieve an impedance bandwidth of 29.1%, ranging from 25.5~34.2 GHz with a peak realized gain of 6.14 dBi, which can be applicable for 5G communication.