2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第3页

Effect of Undercut due to Isotropic Etch while Releasing on the Performance of TPoS Resonators 释放时各向同性蚀刻对TPoS谐振器性能的影响

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100769

J. Bijay, K. N. Bhadri Narayanan, A. Sarkar, A. DasGupta, D. Nair

{"title":"Effect of Undercut due to Isotropic Etch while Releasing on the Performance of TPoS Resonators","authors":"J. Bijay, K. N. Bhadri Narayanan, A. Sarkar, A. DasGupta, D. Nair","doi":"10.1109/EuroSimE56861.2023.10100769","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100769","url":null,"abstract":"This paper reports and validates the effect of additional loss due to the isotropic etch used to release the extensional mode thin piezoelectric on silicon (TPoS) resonators. Devices fabricated to operate at a resonant frequency around 1 GHz are kept at varying times in vapor HF to remove the buried oxide, thereby changing the additional area etched. When devices designed with different geometries are present in the same wafer, the etching times differ, causing more undercuts than required in some of the devices. The Quality factor (Q) calculated from the measured transmission characteristics is used to derive a semi-analytical model for the additional loss due to undercut. The total quality factor of these devices is estimated after adding other loss mechanisms with the help of simulations and is validated with measured experimental data from our group as well as those found in the literature. The Q predicted using this model matches the measured data for state-of-the-art devices with different frequencies, dimensions, and materials.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133793674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading. 循环载荷下考虑亚临界界面断裂参数的包层分层表征与模拟。

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100778

R. Kniely, J. Heilmann, F. Huber, B. Wunderle

{"title":"Characterization and simulation of delamination on package-level considering sub-critical interfacial fracture-parameters under cyclic loading.","authors":"R. Kniely, J. Heilmann, F. Huber, B. Wunderle","doi":"10.1109/EuroSimE56861.2023.10100778","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100778","url":null,"abstract":"Delamination is a significant risk to the reliability of optical sensor packages. This is especially the case when undergoing reliability stress tests, such as cyclic loading. Characterization of the fatigue behavior of different materials in use is difficult challenging due to the limited access to samples that represent the actual packaging process. To address this challenges, a special fatigue bending test setup was used to generate crack growth characteristics for the interface between silicon tiles and non-conductive die-attach adhesive. A virtual crack closure technique was applied to calculate the strain energy release rate using the finite element method. Using the data, a fatigue crack growth rate curve was generated, to show the sub-critical crack propagation and determine the constants of Paris’ law. In addition, successfully conducted tests on samples to analyze the interface between injection-molded liquid crystal polymer to nonconductive adhesive and silicon tiles to Ag-filled conductive adhesive are presented in this work.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116776636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Modeling of in-plane distortions and overlay errors encountered during 3-D NAND flash device fabrication 三维NAND闪存器件制造过程中遇到的面内畸变和叠加误差建模

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100780

O. O. Okudur, Mario Gonzalez, G. Van den bosch, M. Rosmeulen

引用次数: 0

PCBA reliability simulation in the cloud 云中的PCBA可靠性仿真

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100837

Harald Ziegelwanger

引用次数: 0

Leadframe-Epoxy Moulding Compound Adhesion: a Micromechanics-driven Investigation 引线框架-环氧成型复合材料粘接:微观力学驱动的研究

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100792

Alessandro Della Porta, S. Mariani, M. Rovitto, L. Andena, Samuele Zalaffi

{"title":"Leadframe-Epoxy Moulding Compound Adhesion: a Micromechanics-driven Investigation","authors":"Alessandro Della Porta, S. Mariani, M. Rovitto, L. Andena, Samuele Zalaffi","doi":"10.1109/EuroSimE56861.2023.10100792","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100792","url":null,"abstract":"A typical reliability issue of electronic packages is the decohesion between the encapsulant material, the Epoxy Molding Compound (EMC), and the leadframe. As the EMC is a microstructured composite material, the present computational study is aimed at understanding the influence of the EMC microstructure on the macroscopic mechanical and adhesive properties. Statistical Volume Elements (SVEs) are employed to this purpose, with a random arrangement of spherical particles of varying diameter to represent the filler volume fraction and size distribution. Mechanical properties of the neat polymeric matrix are obtained from experimental data relevant to the EMC through an inverse homogenization scheme, and the effect of a varying filler content is investigated. Finally, microstructural effects on the adhesion are studied with micro-scale models of the leadframe-matrix-filler system, accounting for the leadframe-matrix adhesion through a cohesive approach. The effects of filler content, substrate roughness, and intrinsic adhesive properties on the effective traction-separation law are assessed.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134588791","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Fully-Coupled Transient Modeling of Highly Miniaturized Electrostatic Pull-In Driven Micropumps 高度小型化静电拉入驱动微泵的全耦合瞬态建模

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100814

Wolfgang Hölzl, M. Seidl, G. Schrag

{"title":"Fully-Coupled Transient Modeling of Highly Miniaturized Electrostatic Pull-In Driven Micropumps","authors":"Wolfgang Hölzl, M. Seidl, G. Schrag","doi":"10.1109/EuroSimE56861.2023.10100814","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100814","url":null,"abstract":"We present a problem-adapted finite element model, which enables the design of a novel type of a MEMS membrane pump as well as the investigation and the optimization of its operation, which heavily relies on the electrostatic pull-in of a radial membrane. The electro-mechanical actuation scheme constitutes a strongly coupled problem, which causes convergence problems due to the singular behavior of the electrostatic loads at small distances, as well as the highly non-linear mechanical contact. We overcome these issues by introducing problem-adapted regularization functions. These drastically improve the convergence behavior and the computation time, while at the same time causing only very small approximation errors. The resulting simulation model allows to gain a better understanding of the device operation, in particular to identify a failure condition of previously manufactured prototypes, where fluid is trapped in the pump chamber. Furthermore, it allows to quickly assess a design optimization that prevents this trapping and improves the overall device operation.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129151215","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Ab initio derived force field potential for the accurate simulation of thermal transport in AlN 为精确模拟氮化铝的热输运，从头算导出了力场势

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100760

Simon Fernbach, E. Kraker, N. Bedoya-Martínez

引用次数: 0

Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach 通过使用降阶建模方法评价电子器件的热力学行为

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100800

M. Weninger, J. Zündel, T. Krivec, M. Frewein, S. Waschnig, P. Fuchs, C. Obst

{"title":"Evaluation of thermomechanical behavior of electronic devices through the use of a reduced order modelling approach","authors":"M. Weninger, J. Zündel, T. Krivec, M. Frewein, S. Waschnig, P. Fuchs, C. Obst","doi":"10.1109/EuroSimE56861.2023.10100800","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100800","url":null,"abstract":"Warpage is an issue in the manufacturing of electronic packages. The main driver for this effect is the mismatch of material properties especially during temperature cycling. To predict warpage before building samples, the FEM (Finite Element Method) is used in this study. PCBs (Printed Circuit Boards) are assembled in array format. Thus the simulation should be done in this format. Studies investigated PCBs thru a detailed representation [1]. However, no studies were found which simulate an array of PCBAs (Assembled PCBs). This is mainly due limitation of the hardware memory. The array of m2x modules in this work is not feasible to be calculation thru a usual modelling approach, even not through cloud computing. Thus this study investigates the use of substructures to overcome the hardware limitations. The array was manufactured and the simulation results were validated by using DIC (Digital Image Correlation). The predicted warpage of the novel modelling approach is well aligned with the measurement results.The establishment of the method for array format warpage assessment significantly decreases the development times for electronic packages, due to the mitigation of reliability risks and thus design cycles.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116335485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations 热-机械有限元模拟验证的QFN封装变形分析

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100821

Chinmay Nawghane, Thomas Moncond'huy, B. Vandevelde, P. Vernhes, R. Cruz

{"title":"Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations","authors":"Chinmay Nawghane, Thomas Moncond'huy, B. Vandevelde, P. Vernhes, R. Cruz","doi":"10.1109/EuroSimE56861.2023.10100821","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100821","url":null,"abstract":"Electronic package deformation is a possible cause for reliability issues. The deformations and warpage are caused by the in-plane coefficient of thermal expansion (CTE) mismatch between epoxy molding compound (EMC) and other materials inside package. The objective of this study is to investigate the warpage in Quad flat nolead (QFN) packages and establish a correlation between projection moiré experiments and finite element simulations. FE simulations demonstrates the importance of temperature dependent material models for the warpage simulations and shows how it affect the warpage results and shape of the warping package. With the viscoelastic material model for an EMC and temperature dependent CTE, simulations illustrate the true shape of the QFN package warpage, but simulations overestimate the absolute warpage values specifically at peak temperatures. It has been identified that the dominant factor behind package warpage is the CTE difference between EMC, copper lead frame and silicon die. This paper also compares CTE measurements from experiments with FE simulations and FEA predictions are within tolerable limits of ± 1 ppm$/ ^{circ}mathrm{C}$ which validates the FE model.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114142340","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Effect of Thermomigration on Electromigration in SWEAT Structures 热迁移对SWEAT结构中电迁移的影响

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100774

Z. Cui, Xuejun Fan, Guoqi Zhang

引用次数: 0