2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

{"title":"Degradation of silicone-based sealing materials used in microelectronics","authors":"M. Y. Mehr, P. Hajipour, H. Zeijl, W.D. van El, Thierry Cooremans, F. D. Buyl, G.Q. Zhang","doi":"10.1109/EuroSimE56861.2023.10100796","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100796","url":null,"abstract":"Adhesive bonding is a key joining technology in many industrial applications, including automotive, aerospace industries, biomedical devices, and microelectronic components. Adhesive bonding is gaining more and more attention due to the increasing demand for joining similar or dissimilar components, mostly within the framework of designing lightweight structures. Silicone sealant is widely used in engineering application due to its thermal stability, excellent energy absorption, and good damping characteristics. In those applications, sealant usually exposed to various environment stress, such as, high temperature, mechanical stress, humidity, light radiation, and chemical attack. Long-term stability and durability of sealant is crucial to the performance of the associated application. The main degrading factors for silicone in microelectronic applications are temperature, humidity, alkali, and mechanical loading. The focus in the present paper is to understand different failure mechanisms in silicone sealants and adhesives and to study how different environmental, mechanical, and service-related stresses attribute to the kinetics and extent of degradation in silicone sealants and adhesives. The impact of different failure mechanisms on the lifetime and reliability of microelectronic devices will be methodically investigated.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"2012 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121465068","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Probabilistic and Physics-Informed Machine Learning for Predictive Maintenance with Time Series Data","authors":"P. Vu, Emanuel Aldea, Mounira Bouarroudj, S. L. Hégarat-Mascle","doi":"10.1109/EuroSimE56861.2023.10100781","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100781","url":null,"abstract":"Physics-informed neural networks are capable of learning from both observation data and the underlying physical laws. Meanwhile, their implementation in real application settings requires additional considerations related to multi-objective optimization of variables with vastly different scales. Besides, many applications benefit from having well-calibrated uncertainty estimate along with the prediction. In this study, we examine physics-informed neural network for a predictive maintenance application with times series data, using a physical fatigue crack propagation model from mechanical engineering. Our goal is to attain good predictive performance, while at the same time producing correct uncertainty intervals and limiting computation cost. Moreover, we also consider as baselines some established uncertainty quantification techniques in deep learning, and we provide a detailed quantitative assessment of their calibration.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121476727","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Influence of the quality of material models on warpage and lifetime prediction by finite element simulation","authors":"J. Zündel, M. Weninger, T. Krivec, M. Frewein, S. Waschnig","doi":"10.1109/EuroSimE56861.2023.10100777","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100777","url":null,"abstract":"The ever-increasing demand towards sustainability and reduction of the ecological footprint results, as a direct impact on the electronics industry, in reliability simulation and lifetime prediction of printed circuit boards (PCBs) and electronic modules becoming more and more inevitable. Accurate prediction, however, requires sophisticated material models of all base materials that are capable of representing the actual material behavior under the given loading situations during manufacturing and application. This study addresses the highly problematic lack of available material data of dielectric and conductive base materials commonly used in PCB manufacturing and its influence on warpage and reliability simulation. An M2X communication module PCB comprising coupons for reliability testing is used to compare measured data to simulated results obtained by using material models with different degrees of comprehensiveness, beginning from data sheet values provided by material suppliers to the fully characterized temperature-dependent and orthotropic material behavior of fiber-reinforced dielectrics, resins and copper. Depending on the quality of the implemented material data, significant differences were observed when evaluating the simulated results. Comparison to the measured warpage of the module and the lifetime determined by hot oil temperature cycle testing makes it obvious that insufficient material data lead to inconclusive results or inaccurate predictions, with, if being nevertheless relied on, potentially serious consequences during the application of the real products. Based on these findings, suggestions for best-practice material models of dielectrics and copper are presented, as it could be proven that the comprehensive understanding of material behavior is the key to reliable warpage and lifetime predictions of PCBs and electronic modules by simulation.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"182 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124594711","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Fatigue behavior of Au, Cu and PCC fine wire bond connections for power LED applications","authors":"B. Czerny, S. Schuh","doi":"10.1109/EuroSimE56861.2023.10100839","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100839","url":null,"abstract":"One of the main reliability issues in power LED devices is the bond wire connection due to wire neck breakage. Time consuming thermal cycling or thermal shock tests are the standard testing methods to evaluate this lifetime. Furthermore numerical or simulation methods are used as a convenient and fast substitution, but accurate reliability and lifetime material models are difficult to obtain. For this purpose, a mechanical fatigue testing system was designed to induce mechanical stresses to the critical region of the bond wire connection above the ballbond to expedite fatigue cracks at this bottleneck. The purpose is to induce similar fatigue failure mode as during thermal tests. The experimental investigations are carried out on Au, Cu and Pd-coated Cu bonding wires with a diameter of 25 μm using low and high frequency excitation. The obtained lifetime of the wire bond ranges from 100 - 1 000 000 cycles. The proposed testing method provides material lifetime data in a very short period of time with minimal sample preparation. Finite element simulations were conducted to quantify the stresses at the wire neck which allows a comparison to conventional testing methods, operation conditions fatigue test comparisons, material models and design evaluations of fine wire bond reliability in LED and microelectronic packages.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124636479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"MEMS Cantilever on High-Cycle Fatigue Testing of thin Metal Films","authors":"N. Jöhrmann, C. Stöckel, B. Wunderle","doi":"10.1109/EuroSimE56861.2023.10100848","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100848","url":null,"abstract":"Aluminium is still one of the most important contact metallisation for power electronic chips like MOSFETs or IGBTs. With a large difference in thermal expansion coefficients (CTEs) between aluminium and silicon or silicon carbide, and the temperatures generated in hot-spots during high power transients, these layers are prone to failure due to thermo-mechanical fatigue. Usually lifetime assessment is done by subjecting dedicated test specimens to standardised stress tests as e.g. thermal cycling. This paper builds on previous work about a method for accelerated stress testing and lifetime modelling of thin aluminium films in the high-cycle fatigue regime by isothermal mechanical loads using Si MEMS cantilevers as sample carriers. Surface roughness of the fatigued films was previously measured as a failure parameter, both via atomic force microscopy (AFM) and scanning electron microscopy (SEM). This was motivated within a physics-of-failure based reliability paradigm by comparison with equivalent plastic strain obtained from finite element simulations, which show a relation between surface roughness and the cumulated plastic strain. By using a new design including two AlN piezos, it is now possible to realize a closed loop control without the need for an external shaker and an optical setup to measure the cantilever amplitude during the fatiguing. This also enables easier Insitu stress testing, e.g. inside a SEM or below an optical microscope, to gain further insight into the development of degradation of the thin aluminium over time. An accelerated stress test with 107 cycles using the new design is presented, and surface roughness obtained via optical microscopy is compared with finite element simulations.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131866108","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Improving the Vibration Reliability of SAC Flip-Chip Interconnects Using Underfill","authors":"R. Höhne, K. Meier, M. Reim, M. Lehmann, K. Bock","doi":"10.1109/EuroSimE56861.2023.10100809","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100809","url":null,"abstract":"In this study the vibration durability of Flip-Chip (FC) solder interconnects at room temperature (RT) was investigated. A specimen design, specially designed for vibration fatigue investigations at various temperatures, was modified for the use of FC components. Daisy-chain structures allow an in-situ electrical resistance monitoring in order to precisely detect failure events. A 20% increase of the initial resistance was used as the failure criterion. Two different solder alloys, SAC305 (Sn96.5 Ag3.0 Cu0.5) and Innolot®, as well as components either w/ or w/0 underfill material (UM) were used for the vibration fatigue investigation in this study. Destructive physical analysis (DPA) was conducted by means of cross-sectioning in order to inspect failure sites and crack propagation within the solder joints. Using the obtained time to failure (TTF) data of the experiments, reliability (Weibull) analysis was conducted and Weibull distribution parameters were derived. SAC305 solder alloy was found to be much more fatigue resistant against vibration loads compared to Innolot®. As expected, using an UM to enhance the physical strength of the FC solder joints, increased the characteristic life under vibration load by up to 13-fold.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"83 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130445615","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal Stresses in a Bi-Layer Assembly in Electronics Packaging","authors":"Mathews T Vellukunnel, Mukunda Khanal, Xuejun Fan","doi":"10.1109/EuroSimE56861.2023.10100842","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100842","url":null,"abstract":"Bi-material interfaces have practical applications in semiconductor packaged devices as a typical semiconductor package is a layered assembly consisting of various materials having different coefficients of thermal expansion (CTEs). CTE mismatch-induced thermal stresses during heating, cooling, or temperature cycling cause failures of semiconductor devices in manufacturing and operation conditions. It is well known that the laminates develop free-edge stresses that are major causes of interface delamination or cracking. Timoshenko first developed analytical solutions for axial stress and curvature radius using classical bending theory. However, stresses at the end of a bi-material interface are neglected. Suhir developed analytical solutions for peeling and shear stresses near the edges, but the stresses are considered bound with certain values. When bi-materials are both considered linear elastic, the peeling stress is singular at the free edges. In this paper, finite element analysis is performed to investigate the stress and deformation of a bi-layer strip assembly. The axial stress that acts in the longitudinal direction of the assembly can be accurately predicted by Timoshenko’s theory. The curvature of the assembly, or warpage using the terminology in electronics packaging, can also be predicted accurately using Timoshenko’s equation. However, the peeling stress at the free edge appears to be mesh-dependent, indicating an infinite stress value. Despite the free surface at the free edge, shear stress is also mesh-dependent. The fracture mechanics approach is often used to take singular behaviors into consideration for the extraction of meaningful fracture parameters. However, only the standard type of crack or interface crack is considered in the context of classical fracture mechanics. To tackle this issue, the finite element mesh should keep the fixed size and shape at the location of interest where the singular point exists. This approach provides a simple way for relative stress comparison in different designs, although the absolute value of stress components has no actual meaning. In this paper, we also find that the peeling stress is in tension during cooling but in compression during heating, regardless of the material properties.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130536942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Application of Machine Learning to Recognize Wire Bond Lift-Off in Power Electronics Manufacturing","authors":"H. Huai, N. Chidanandappa, J. Wilde","doi":"10.1109/EuroSimE56861.2023.10100782","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100782","url":null,"abstract":"In this paper, machine learning is used to teach a software to detect wire bond lift-offs in power electronic modules. To show the feasibility of this method, a DCB with four aluminum wires is analyzed. Using SolidWorks, different failure states of the device under test with varying wire bond lengths and heights are created. The models are then running through a magnetostatic simulation in Ansys Maxwell. Using the simulation results, sixteen magnetic field values are extracted based on their placements in an existing printed circuit board. The values of some simulation results are used to train a machine learning algorithm based on supervised learning, while the rest are used to verify the algorithm. For this work, the support vector machine and decision tree algorithms are tested and compared to each other. The results show that both methods work well and can give good results for one wire failure using a data set of only 100.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128384617","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"UV LEDs: Performance and Reliability for Commercial InGaN and AlGaN LED Products","authors":"J. Davis, Kelley J. Rountree, R. Pope, Karmann Riter, Clint Clayton, Andrew Dart, M. McCombs, Abdal Wallace","doi":"10.1109/EuroSimE56861.2023.10100797","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100797","url":null,"abstract":"The goal of this study was to investigate the state of commercial UV LED products in the 2021 timeframe from the standpoint of initial performance and long-term reliability. In performing this work, 14 different UV LED products, covering the UV-A and UV-C bands, were studied. The initial performance of populations of each product was measured using spectroradiometry and current-voltage (I-V) profiles. Then, the samples were operated at room temperature for up to 3,000 hours, and the performance degradation was followed using spectroradiometry and I-V measurements. In examining the lifetime performance of the UV LEDs, three primary mechanisms of aging were uncovered, and the occurrence of each depended greatly on the UV band and the LED manufacturer. Abrupt failure of the UV LEDs was only observed in specific AlGaN products. The second failure mechanism was the growth of a parasitic diode in parallel with the light-emitting device, and this mechanism, which occurred for products across both bands, resulted in significant reductions in radiant flux. The third aging mechanism identified in this work is package degradation caused by exposure to the UV radiation. This effect is especially pronounced in the UV-A band, which tended to use electronics package materials similar to those of white LEDs. This paper will discuss the evidence of these three degradation mechanisms and their impact on the long-term performance of UV LEDs.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129707764","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Frequency Analysis of Dual-Phase-Lag Heat Conduction Model","authors":"A. Sobczak, Grzegorz Jabłoński, M. Janicki","doi":"10.1109/EuroSimE56861.2023.10100822","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100822","url":null,"abstract":"The classic law of heat conduction proposed by Fourier often fails to predict correctly the temperature evolution in time, especially in nanosized structures or in the case of rapidly changing heat fluxes. The Dual-Phase-Lag heat conduction model is supposed to overcome these issues. However, the most frequently used version of this model employs the first-order Taylor approximation of its original version. This paper, based on the thermal analyses carried out for a one-dimensional silicon structure in the frequency domain, discusses fundamental limitations resulting from this approximation.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126488196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}