2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

{"title":"Determination of Lemaitre Damage Parameters for Al H11 Wire Material","authors":"S. Kuttler, B. Abali, O. Wittler","doi":"10.1109/EuroSimE56861.2023.10100825","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100825","url":null,"abstract":"The quality of wirebond interconnects is characterized by shear and pull tests. For such a simulation we need an adequate damage model, since a purely elasto-plastic model fails to give the full picture [1]. For the description of damage, the Lemaitre damage model is selected, because this model is already used in comparable blanking simulations [2]. In addition, the main damage-driving factor of this damage model is the equivalent plastic strain, which is known to be the suitable failure criteria for ductile materials. The model, introduced by Lemaitre in 1985, is for isotropic ductile damage [3]. It has been used and extended in many other works. Still, more than three decades later, modelling free evolving multiaxial damage is often a more scientific topic and has not yet been proven a sufficient engineering tool to investigate destructive tests by numerical simulation. Reducing the amount of tests has been and still is a demand to save time in the design process. Therefore, it is needed to further investigate the capabilities of such damage models on complex applications. Indeed, the damage parameters first need and will be determined in this study for the material used in the application.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"115 22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126376533","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Two-Phase Flow Simulation of Capillary Underfilling as a Design Tool for Heterogenous Integration","authors":"Lisa Christin Stencel, Jörg Strogies, Rüdiger Knofe, B. Müller, Carsten Borwieck, M. Heimann","doi":"10.1109/EuroSimE56861.2023.10100773","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100773","url":null,"abstract":"Encapsulation is gaining relevance for the miniaturization of power modules to enhance dielectric, mechanical, and thermomechanical reliability. Capillary underfill is a flexible method for encapsulating vertical integration concepts in power electronics. To ensure defect-free application, a robust and accurate two-phase flow model is presented that can predict both shape and velocity of the moving interface. The study discusses three general concepts for targeted flow control and void prevention: Local flow speed adaption, gap compartmentation, and arcuate shapes to force a chip near confluence of multiple flow fronts. The beneficial effect of these design features is verified with experimental test setups. Simulated and experimentally captured flow fronts are quantitatively evaluated using the normalized difference in filled gap area as a benchmark for experimental validation. A very good agreement is found with 2.8-3.4% relative deviation. For void-critical applications, this study demonstrates the ability to use a VOF based two-phase flow model to derive individually tailored flow manipulation measures, highlighting the potential of a simulation-based design tool for capillary underfilling.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126428373","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Simulation of Temperature Driven Microflows Using a Lattice Boltzmann Method in Slip and Moderate Transition Regimes","authors":"Anas Selmi, Sahil Bhapkar, Cristian Nagel, A. Kummerländer, M. Krause","doi":"10.1109/EuroSimE56861.2023.10100812","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100812","url":null,"abstract":"Micro-electromechanical systems (MEMS) are very small devices that usually contain gas under low pressure. The motion of the fluid inside such structures is affected by rarefaction effects, which are not visible in macroscale flows. To accurately predict the behavior of the fluid in such microstructures, the Lattice Boltzmann Method needs to be modified to account for these new effects. This can be done by introducing relative fluid-wall velocity in the form of slip boundary conditions. Furthermore, temperature effects like temperature jump and thermal creep can be included using wall boundary conditions. In this paper, different models for the slip are explored and evaluated over the Knudsen number. Then, a thermal flow is simulated and benchmarked by Direct Simulation Monte-Carlo (DSMC). The results show that these extensions offer a good approximation in the slip and moderate transition regimes (Knudsen number (Kn) < 1).","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132114906","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound","authors":"A. Inamdar, M. Soestbergen, A. Mavinkurve, W. V. Driel, Guoqi Zhang","doi":"10.1109/EuroSimE56861.2023.10100833","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100833","url":null,"abstract":"Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical, electrical, and chemical behaviour. High-temperature ageing of electronic packages causes the oxidation of epoxy moulding compounds (EMC), forming a layer exhibiting significantly different thermomechanical properties. This reflects in the modified mechanical behaviour of the entire package, which accelerates certain failure modes and affects component reliability. Thus, it is crucial to consider gradual degenerative changes in EMC for a more accurate estimation of the component lifetime. This paper proposes a three-step modelling approach to replicate thermo-chemical changes in package encapsulation. A parametric geometry of a test package was incorporated with the ageing stage-dependent changes in thermomechanical properties of the oxidized layer. The mechanical behaviour of oxidized EMC at multiple stages of thermal ageing (at 150°C for up to 3000 hours) was first experimentally characterized and then validated using warpage measurements on thermally aged test packages and Finite Element (FE) simulations. Lastly, a trend-based interpolation of material model parameters for intermediate stages of ageing was followed, and a continuously updated degradation model (physics-based Digital Twin) was achieved. The proposed model is capable of reproducing degraded stages of the test package under thermal ageing along with its modified thermomechanical behaviour. Its limitations and significance in the domain of health monitoring of microelectronics are also discussed.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128978387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Finite Element Model for Prediction of Back-End-of-Line Process Induced Wafer Bow for Patterned Wafer","authors":"P. Singh, K. Machani, D. Breuer, M. Hecker, K. Meier, F. Kuechenmeister, M. Wieland, K. Bock","doi":"10.1109/EuroSimE56861.2023.10100826","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100826","url":null,"abstract":"With the increased technological advancement within the semiconductor industry, there has been a need for wafer level products that allow for higher electrical performance and increased power efficiency. This leads to more metal content in the back-end-of-line wafer fabrication process. During the wafer fabrication process a large amount of stress is generated in back-end-of-line which can lead to severe wafer bow. High wafer bow can cause fabrication issues. In order to understand and predict the wafer bow, finite element method based models were developed to support back-end-of-line process step definitions and setting design rules to limit the wafer bow. In the finite element method based model, the fully patterned back-end-of-line stack is replaced by effective orthotropic material properties generated at several die level models to capture the non-uniform metal density across the wafer. Finally, the current study shows that the newly developed finite element method models are in good agreement with experimental data.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127783392","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Numerical Simulation of Crosstalk Effects in PMUT Arrays","authors":"O. M. Abdalla, G. Massimino, Cristina D’Argenzio, Matteo Colosio, M. Soldo, F. Quaglia, A. Corigliano","doi":"10.1109/EuroSimE56861.2023.10100789","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100789","url":null,"abstract":"The significant negative influence of crosstalk among the diaphragms of Piezoelectric Micromachined Ultrasonic Transducers (PMUT) drives its mechanical and acoustic behavior to deviate from the desired ideal performance. Crosstalk analysis on a 4 × 4 PMUT array designed for in-air applications is presented in this study. It is suspected that crosstalk occurs primarily through acoustic coupling among transducers, or more precisely, through the acoustically connected cavities. A comprehensive set of numerical models representing two adjacent PMUTs working under varying levels of acoustic coupling is investigated in order to understand the level of acoustic crosstalk through the cavities and its impact on the array performance. The numerical results are then validated with experimental data. The computed response spectra of the PMUTs reveal that the presence of secondary peaks, which indicate the presence of crosstalk, is reduced when the transducers are partially or entirely decoupled as compared to a fully coupled case.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133705904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Anand model calibration for SAC305 solder joints based on the evolution of the shear stress and strain hysteresis loops for different thermal cycling conditions","authors":"J. Libot, Zoé Bussière, L. Mahfouz, J. Alexis, O. Dalverny","doi":"10.1109/EuroSimE56861.2023.10100843","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100843","url":null,"abstract":"Since 2006 and the introduction of the RoHS legislation preventing the use of lead in electronic assemblies, lead-free solder alloys have gained interest amongst the industry and academics with the introduction of new solder alloy compositions. Solder joint durability has been widely studied, especially the SAC305 solder composition, one of the most common lead-free alloy used in electronic equipment. Assessing solderjoint durability can consists in performing Accelerated Temperature Cycling (ATC) tests to measure durability data. Finite Element Analysis (FEA) can also be performed in order to correlate a thermomechanical fatigue criterion, such as the inelastic strain energy density, with the durability data for different test configurations to develop a fatigue model. However, accurately calculating the inelastic strain energy density dissipated in solder interconnections during thermal cycling requires knowledge of the solder material’s behavior law. Under thermal cycling conditions, SAC305 solder behaves as a highly viscoplastic material and is often described using the Anand model.This study presents the methodology considered to determine the Anand viscoplastic model representative of actual SAC305 solder joints. The experimental procedure which consists of a custom-made 76 I/O Ceramic Ball Grid Array (CBGA76) assembly instrumented with four strain gauges and subjected to three different thermal cycling conditions is described $(triangle mathrm{T}=[-25^{circ}mathrm{C}, 125^{circ}mathrm{C}], [0^{circ}mathrm{C}, 100^{circ}mathrm{C}]$ and [−40°C, 85°C]). The strain gauges allow to determine the shear stresses and shear strains applied on the critical solder balls during temperature cycles. The obtained experimental shear stress and strain hysteresis loops are compared with the numerical hysteresis loops determined with the FEA. By assessing the effect of each Anand parameter on the shape of the hysteresis loop plotted for the thermal cycle between −25°C to 125°C, the best-fit parameters for the Anand viscoplastic model was derived. The model was then validated considering the temperature cycles between −40°C to 85°C and 0°C to 100°C.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133839506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Trigger specific failure in LED system by power and duty cycle patterns lifetime testing","authors":"J. Magnien, L. Mitterhuber, K. Fladischer, J. Rosc, E. Kraker","doi":"10.1109/EuroSimE56861.2023.10100790","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100790","url":null,"abstract":"A standard test method for lifetime testing in the field of semiconductor devices is the active cycling test, which also finds its application for LEDs. In this work, different boundary conditions of reliability testing, applied at power and duty cycles, are discussed. A workflow for developing a testing procedure, aligned to the device under investigation, is presented. A validated finite volume simulation is used to verify the structure levels of an LED application and to study temperature time evolution by active cycling. The different active cycling parameters can be adjusted in such a way that different failure modes are triggered. The right choice of parameters, hence the optimized testing strategy, will lead to a time reduction of the lifetime testing and improve LED service testing.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134067053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Model order reduction for nonlinear modal analysis of MEMS devices: theory and recent advancements","authors":"A. Opreni, Peter Degenfeld-Schonburg","doi":"10.1109/EuroSimE56861.2023.10100804","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100804","url":null,"abstract":"Designing resonating components as MEMS gyroscopes, micromirrors, and resonators requires accurate prediction of their nonlinear dynamic response. This ensures avoiding undesired effects as hardening/softening behaviour and internal resonance. However, computing oscillatory stationary states in MEMS systems with high quality factors from finite element models is prohibitively costly from a computational viewpoint, hence model order reduction techniques are necesssary. In the present work we detail computational aspects of model order reduction techniques suitable for MEMS devices exhibiting geometrically nonlinear behaviour, together with numerical results provided by state of the art methods on MEMS components.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133548254","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Non-intrusive electro-thermo-mechanical reduced model for diagnosis and prognostic on IGBT power modules","authors":"Lou Schuler, L. Chamoin, Z. Khatir, Mounira Bouarroudj, M. Ouhab","doi":"10.1109/EuroSimE56861.2023.10100766","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100766","url":null,"abstract":"In this work, a reduced model based on the Proper Generalized Decomposition is developed to model the electro-thermo-mechanical of IGBT power module. The reduced model enables obtaining the solution to the coupled problem considering multiple model parameters. Focusing on the wire bond lift-off mechanism, a lifetime model is built based on the stress level at the wire bond metallization interface. The reduced model is then advantageously used to perform model updating using Bayesian inference.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121389883","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}