2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - 最新文献
Pub Date : 2023-04-17
DOI: 10.1109/EuroSimE56861.2023.10100828
Ulrike Fitzer, D. Hohlfeld, T. Bechtold
Pub Date : 2023-04-17
DOI: 10.1109/EuroSimE56861.2023.10100824
R. Ardito, C. Comi, V. Zega, A. Corigliano
Pub Date : 2023-04-17
DOI: 10.1109/EuroSimE56861.2023.10100749
A. Sitta, Giuseppe Mauromicale, M. Torrisi, G. Sequenzia, G. D'Arrigo, M. Calabretta
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