2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

Neuron-Electrode Interface with Hodgkin-Huxley Model in ANSYS 基于ANSYS的霍奇金-赫胥黎模型的神经元-电极界面

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100828

Ulrike Fitzer, D. Hohlfeld, T. Bechtold

引用次数: 0

Metamaterials and MEMS (MetaMEMS): a promising trend in Microsystems technology 超材料和微机电系统(MetaMEMS):微系统技术的一个有前途的趋势

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100824

R. Ardito, C. Comi, V. Zega, A. Corigliano

引用次数: 0

Characterization and simulation of four bending test to estimate resin-copper adhesion 四次弯曲试验的表征与模拟，以评估树脂-铜的附着力

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100749

A. Sitta, Giuseppe Mauromicale, M. Torrisi, G. Sequenzia, G. D'Arrigo, M. Calabretta

引用次数: 0

A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure 基于sram的28nm FPGA在中子辐射下的概率软误差模型

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100757

Gia Bao Thieu, Johannes Schmechel, K. Weide-Zaage, Katharina Schmidt, Dorian Hagenah, G. Payá-Vayá

{"title":"A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure","authors":"Gia Bao Thieu, Johannes Schmechel, K. Weide-Zaage, Katharina Schmidt, Dorian Hagenah, G. Payá-Vayá","doi":"10.1109/EuroSimE56861.2023.10100757","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100757","url":null,"abstract":"Bit errors due to radiation effects are becoming increasingly important as the fabrication technologies are shrinking with every generation of integrated circuits. The resulting smaller transistors are more prone to high-energy irradiation. This is relevant in avionics or even automotive, where the safety of millions of cars must be ensured. This paper proposes an experiment, where multiple FPGAs (Field Programmable Gate Arrays) are exposed to 2.45MeV neutron irradiation in parallel. Bitflips in different memory components (Block RAM, Flip-Flops, lookup-tables and configuration memory) are detected. The results show that bitflips could be detected in every memory component in every part of the FPGA. Finally, a soft-error probability model depending on the irradiation fluence can be determined. With the probability model, future implementations of fault-tolerant hardware architectures can be tested with hardware simulations using artificially generated bitflips.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116282196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Using Grid Search Methods and Parallel Computing to Reduce AI Training Time for Reliability Lifetime Prediction of Wafer-Level Packaging 基于网格搜索和并行计算的晶圆级封装可靠性寿命预测AI训练时间缩短

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100751

C. Y. Chang, C. H. Lee, K. Chiang

{"title":"Using Grid Search Methods and Parallel Computing to Reduce AI Training Time for Reliability Lifetime Prediction of Wafer-Level Packaging","authors":"C. Y. Chang, C. H. Lee, K. Chiang","doi":"10.1109/EuroSimE56861.2023.10100751","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100751","url":null,"abstract":"Electronic packaging technology undergoes Accelerated Thermal Cycling Test (ACTC) before hitting the market. Finite element analysis is commonly used to build models for electronic packaging products. However, simulation errors may arise due to differences in physical concepts and considerations among researchers. To overcome this challenge, we create a database through validated finite element models and combine it with machine learning. In the domain of machine learning models, training time is a crucial research focus. Nevertheless, grid search time is often overlooked, despite its significant impact on machine learning model efficiency. To address this issue, this study utilizes parallel computing to explore the search for optimized hyperparameters in the context of the Wafer Level Chip Scale Package (WLCSP) as a case study. Additionally, custom empirical formulas are utilized to enhance the efficiency of grid search methods, thereby improving the time-to-market and competitiveness of packaged products.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122272837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Warpage of Fan-Out Panel Level Packaging – Experimental and Numerical Study of Geometry and Process Influence 扇形板级封装翘曲——几何和工艺影响的实验和数值研究

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100849

Andreas Stegmaier, O. Hölck, M. Dijk, H. Walter, O. Wittler, M. Schneider-Ramelow

{"title":"Warpage of Fan-Out Panel Level Packaging – Experimental and Numerical Study of Geometry and Process Influence","authors":"Andreas Stegmaier, O. Hölck, M. Dijk, H. Walter, O. Wittler, M. Schneider-Ramelow","doi":"10.1109/EuroSimE56861.2023.10100849","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100849","url":null,"abstract":"In order to reduce waste and cost, the trend in Fan-Out Packaging is the move to rectangular panels instead of circular wafers [1]. These panels can be made in larger formats and better utilize the space due to the rectangular shape. However, with the larger format, warpage of the panels increases and remains a challenge in Fan-Out Panel Level Packaging (FOPLP) production. Warpage occurs mainly due to the multitude of materials that undergo multiple production steps at different temperatures, which leave residual stresses induced by mismatch of thermal strains and strains due to chemical processes (e.g. cure shrinkage). These superimposed effects and the complex material behaviour still make it challenging to predict warpage numerically and control warpage during production [2], [3]. In this work, warpage of nine different variants of a 300 × 300 mm2 panels with dummy dies have been investigated experimentally and numerically. It has been shown that the numerical model can replicate warpage of the panels and the potential for numerically supported warpage adjust steps in the fabrication of the panels has been demonstrated.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131692643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics 微电子中参数化简模型在化简空间中的应力恢复

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100787

I. Zawra, C. Umunnakwe, M. Soestbergen, E. Rudnyi, T. Bechtold

引用次数: 2

FEA-based Layout Optimization of E1.S Solid-State Drive to Improve Thermal Cycling Reliability 基于有限元的E1布局优化。固态硬盘提高热循环可靠性

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100844

Eunho Oh, Junghoon Kim, Y. Cinar, Woosung Kim, B. Lee, Myungryul Jang, Nah-Oak Song, Sun-Gu Lee, Jonggyu Park

{"title":"FEA-based Layout Optimization of E1.S Solid-State Drive to Improve Thermal Cycling Reliability","authors":"Eunho Oh, Junghoon Kim, Y. Cinar, Woosung Kim, B. Lee, Myungryul Jang, Nah-Oak Song, Sun-Gu Lee, Jonggyu Park","doi":"10.1109/EuroSimE56861.2023.10100844","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100844","url":null,"abstract":"E1.S is the family of Enterprise and Data Center Standard Form Factor (EDSFF) for NVMe Solid-State Drive (SSD), providing higher capacities and performance as well as improved power/thermal solution compared to conventional M.2 SSDs. Due to its spatial limitation and high density of NAND packages and other electrical components, however, the BGA-type packages in E1.S enclosure-type SSD suffer from low thermal cycle reliability induced by creep of solder joint, especially in the case of packages near physical constraints like screw joints. In this study, we use Finite Element Analysis (FEA) to estimate the risk of solder joint crack of NAND BGA solder balls near the screw joint in E1.S enclosure-type SSD. The plastic work per cycle on each solder was calculated by FEA and compared to the Dye-and-Pry results of the real SSD sets after thermal cycle test (- 40~85°C) to evaluate the relationship between thermal fatigue life of solder balls and the plastic work. We confirm that the mechanical restraint near the screw joint is the major cause of the reduction of the solder ball fatigue life in the E1.S SSD. Further, we suggest the optimal layout for package placement and housing design to improve thermal cycle by up to 51%, as a design rule of E1.S form factor.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128848356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Impact of mechanical material modeling on the solder joint fatigue analysis of a leadless package mounted at different positions inside a generic aluminum ECU 机械材料建模对通用铝制ECU内不同位置无引线封装焊点疲劳分析的影响

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100779

M. Niessner, Attila Gyarmati, H. Guettler

{"title":"Impact of mechanical material modeling on the solder joint fatigue analysis of a leadless package mounted at different positions inside a generic aluminum ECU","authors":"M. Niessner, Attila Gyarmati, H. Guettler","doi":"10.1109/EuroSimE56861.2023.10100779","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100779","url":null,"abstract":"The solder joint fatigue lifetime of new microelectronics packages is usually experimentally evaluated using generic and unconstrained printed circuit boards (PCBs). In the later application, the PCB carrying the package may be constrained due to the mounting in a housing, which can adversely affect the solder joint fatigue lifetime. Solder joint fatigue simulation can be used as tool along the value chain to anticipate in an early phase a potential degradation of the solder joint lifetime and to evaluate countermeasures, such as a different placement of the package on the PCB inside the housing. The accuracy of the simulation will depend on the quality of the package model passed along the value chain. This paper studies for a discrete power package different types of material modeling which could potentially be communicated along the value chain and their impact on the accuracy of the prediction. All investigated descriptions correctly identify the most critical mounting positions of the discrete power package inside a generic model of an electronics control unit (ECU). The highest accuracy of the prediction is obtained with a non-linear and temperature-dependent material description of the package, followed by an approach using homogenized blocks with effective non-linear material properties are used. For linear-elastic properties, high deviations w.r.t. the non-linear case are observed in case constant properties over temperature are used and the glass transition region of polymers is passed though in the temperature profile of interest. Linear-elastic temperature-dependent properties are identified to be more accurate than linear-elastic constant properties, but are found to deviate in their estimations up to 25% compared to the non-linear material modeling.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124106351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Transient Thermal 2D FEM Analysis of SiC Mosfet in Short-Circuit Operation Including Solidus-Liquidus Phase Transition of the Aluminum Source Electrode 含铝源电极固-液相相变的SiC Mosfet短路瞬态热二维有限元分析

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI: 10.1109/EuroSimE56861.2023.10100775

E. Sarraute, T. Cazimajou, F. Richardeau

引用次数: 1