A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

A. Inamdar, M. Soestbergen, A. Mavinkurve, W. V. Driel, Guoqi Zhang
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Abstract

Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical, electrical, and chemical behaviour. High-temperature ageing of electronic packages causes the oxidation of epoxy moulding compounds (EMC), forming a layer exhibiting significantly different thermomechanical properties. This reflects in the modified mechanical behaviour of the entire package, which accelerates certain failure modes and affects component reliability. Thus, it is crucial to consider gradual degenerative changes in EMC for a more accurate estimation of the component lifetime. This paper proposes a three-step modelling approach to replicate thermo-chemical changes in package encapsulation. A parametric geometry of a test package was incorporated with the ageing stage-dependent changes in thermomechanical properties of the oxidized layer. The mechanical behaviour of oxidized EMC at multiple stages of thermal ageing (at 150°C for up to 3000 hours) was first experimentally characterized and then validated using warpage measurements on thermally aged test packages and Finite Element (FE) simulations. Lastly, a trend-based interpolation of material model parameters for intermediate stages of ageing was followed, and a continuously updated degradation model (physics-based Digital Twin) was achieved. The proposed model is capable of reproducing degraded stages of the test package under thermal ageing along with its modified thermomechanical behaviour. Its limitations and significance in the domain of health monitoring of microelectronics are also discussed.
反映塑型化合物不同热氧化阶段热力学变化的不断更新的包层降解模型
用于封装电子产品的成型化合物通常占据封装体积的很大一部分,并且最容易暴露于外部环境。在高温、高湿和机械振动等恶劣条件下,电子元件的组成材料会发生降解,导致其热、机械、电气和化学行为发生变化。电子封装的高温老化导致环氧模化化合物(EMC)氧化,形成具有明显不同热机械性能的层。这反映在整个封装的机械行为的改变上,这会加速某些失效模式并影响组件的可靠性。因此,为了更准确地估计元件寿命,考虑EMC的逐渐退化变化是至关重要的。本文提出了一种三步建模方法来复制包装封装中的热化学变化。测试包的参数几何结构与氧化层热机械性能的老化阶段相关变化相结合。氧化EMC在多个热老化阶段(在150°C下长达3000小时)的力学行为首先进行了实验表征,然后使用热老化测试封装的翘曲测量和有限元(FE)模拟进行了验证。最后,对老化中间阶段的材料模型参数进行了基于趋势的插值,实现了持续更新的退化模型(基于物理的数字孪生模型)。所提出的模型能够在热老化下再现测试包的退化阶段及其修改的热力学行为。讨论了其在微电子健康监测领域的局限性和意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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