Lou Schuler, L. Chamoin, Z. Khatir, Mounira Bouarroudj, M. Ouhab
{"title":"用于IGBT电源模块诊断和预测的非侵入式电-热-机械简化模型","authors":"Lou Schuler, L. Chamoin, Z. Khatir, Mounira Bouarroudj, M. Ouhab","doi":"10.1109/EuroSimE56861.2023.10100766","DOIUrl":null,"url":null,"abstract":"In this work, a reduced model based on the Proper Generalized Decomposition is developed to model the electro-thermo-mechanical of IGBT power module. The reduced model enables obtaining the solution to the coupled problem considering multiple model parameters. Focusing on the wire bond lift-off mechanism, a lifetime model is built based on the stress level at the wire bond metallization interface. The reduced model is then advantageously used to perform model updating using Bayesian inference.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Non-intrusive electro-thermo-mechanical reduced model for diagnosis and prognostic on IGBT power modules\",\"authors\":\"Lou Schuler, L. Chamoin, Z. Khatir, Mounira Bouarroudj, M. Ouhab\",\"doi\":\"10.1109/EuroSimE56861.2023.10100766\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work, a reduced model based on the Proper Generalized Decomposition is developed to model the electro-thermo-mechanical of IGBT power module. The reduced model enables obtaining the solution to the coupled problem considering multiple model parameters. Focusing on the wire bond lift-off mechanism, a lifetime model is built based on the stress level at the wire bond metallization interface. The reduced model is then advantageously used to perform model updating using Bayesian inference.\",\"PeriodicalId\":425592,\"journal\":{\"name\":\"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-04-17\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EuroSimE56861.2023.10100766\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EuroSimE56861.2023.10100766","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Non-intrusive electro-thermo-mechanical reduced model for diagnosis and prognostic on IGBT power modules
In this work, a reduced model based on the Proper Generalized Decomposition is developed to model the electro-thermo-mechanical of IGBT power module. The reduced model enables obtaining the solution to the coupled problem considering multiple model parameters. Focusing on the wire bond lift-off mechanism, a lifetime model is built based on the stress level at the wire bond metallization interface. The reduced model is then advantageously used to perform model updating using Bayesian inference.