2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献
M. Soestbergen, R. Roucou, M. Rebosolan, J.J. M Zaal
{"title":"Reduction of empiricism in the solder joint reliability assessment of QFN packages by using thermo-mechanical simulations","authors":"M. Soestbergen, R. Roucou, M. Rebosolan, J.J. M Zaal","doi":"10.1109/EuroSimE56861.2023.10100761","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100761","url":null,"abstract":"To ensure sufficient field life of solder joints, standardized stress tests are performed during the development phase of products, where calibrated thermo-mechanical simulations are frequently used to ensure a potentially sufficient robustness margin. In this work we show how simulations are calibrated for the QFN (Quad Flat No leads) package family. Using thorough failure analysis, we found that for QFN packages two types of solder joint failure modes can occur. The first failure mode is a brittle fracture through the intermetallic region near the solder interface, the other mode is a crack through the bulk of the solder. In the simulations we handle both failure modes using two different failure metrics. For the brittle fractures we analyzed the volumetric strain energy density in a thin region near the interface. For bulk fails we computed the volume-averaged inelastic strain energy density across the whole solder joint. Using both metrics we found a correlation between simulation and experimental results, where Miner’s rule was used to correlate the results of any non-functional anchor joint to the experimental results of the functional joints. The correlation can be used to predict the solder performance upfront in the design phase, and thus reduce the experimental effort during product development.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"351 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134430260","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Ananiev, G. M. Reuther, N. Vecchio, P. Altieri-Weimar
{"title":"Size Scaling of Brittle Strength using Multi-Mode Weibull Distribution","authors":"S. Ananiev, G. M. Reuther, N. Vecchio, P. Altieri-Weimar","doi":"10.1109/EuroSimE56861.2023.10100803","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100803","url":null,"abstract":"This paper presents a numerical method to determine optimal parameters of the Integral-based multi-mode Weibull distribution. Its performance and resulting distribution are compared with Smax-based multi-mode Weibull distribution, fitted for the same bending testing data. The advantage of this new method is demonstrated by its ability to predict failure rates due to chip corner cracks that are caused by highly localized stress distribution.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133813107","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
DanielD . Joseph, Anna Saperas López, Pascal Romer, A. Beinert
{"title":"Frame detachment simulation of PV modules under mechanical load","authors":"DanielD . Joseph, Anna Saperas López, Pascal Romer, A. Beinert","doi":"10.1109/EuroSimE56861.2023.10100801","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100801","url":null,"abstract":"Photovoltaic (PV) laminates are attached to aluminium frames using adhesives, which provide structural stability. In most Finite Element Method (FEM) simulations of PV modules, the importance of frame attachments and adhesion between the frame and PV laminate is ignored by using a simplified model in terms of geometry and material model, though they have a definite impact on the behaviour of the module [1]. This can be due to the increase in the computational cost and the complexity of identifying the appropriate material model for the adhesives. However, the adhesive has a strong influence on the behaviour of the PV module exposed to mechanical load. High loads might lead to the detachment of the adhesive and, consequently, the failure of the PV module. Studying the influence of the adhesive, its response under load, and understanding the strength of the adhesive are essential for a correct modelling of the PV module and hence preventing damage to PV modules. Therefore, within this work, two materials, a one-component silicone (1C silicone) and a two-component silicone (2C silicone), are analysed and modelled using a 2-parameter Mooney-Rivlin incompressible hyperelastic material model. The material model is validated using a single lap shear test. A suitable failure criterion is identified at ambient temperature for one-component silicone through an experimental investigation focusing on the tensile and shear stress states of the adhesive. A FEM simulation is performed to determine the stresses in the 1C silicone in a PV module under mechanical load. The comparison to the failure stresses shows, that the stress values within the adhesive are far below the failure stress and hence no frame detachment is expected.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133495630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Manufacturing of an In-Package Relative Humidity Sensor for Epoxy Molding Compound Packages","authors":"Romina Sattari, H. Zeijl, Guoqi Zhang","doi":"10.1109/EuroSimE56861.2023.10100771","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100771","url":null,"abstract":"This study presents the design and fabrication of an in-package relative humidity sensor for epoxy molding compound (EMC) packages. The sensor comprises shielded interdigital electrodes (SIDE) for in-situ monitoring of humidity absorption/desorption in the package encapsulation layer. A novel approach is employed in the device fabrication to maximize the electrical field lines to pass through the EMC and enhance the sensitivity. The manufactured wafer includes 6$times$6mm2 dies, each containing six identical capacitive sensors with an area of 480 $times$ 620 $mu mathrm{m}^{2}$. SU-8 through polymer vias (TPVs) with high aspect ratio were created to locally mold the sensors by EMC. The linear capacitance change with the relative humidity level is simulated in COMSOL Multiphysics. Three designs were compared, and the calibration results show the capacitance value of 1.54 pF and 5.85 pF before and after molding, respectively. The capacitance value stays within the range of 5.85 to 5.86 pF with less than 7 aF variation under different biasing voltages, indicating the stability and robustness of the capacitance.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131996444","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Efficient Simulation of the Effect of Solder Voids and Tilting on the Cooling of Power Semiconductors","authors":"Nils-Malte Jahn, M. Pfost","doi":"10.1109/EuroSimE56861.2023.10100817","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100817","url":null,"abstract":"In this research, a time-efficient and sufficiently detailed simulation model is presented to study the effect of solder voids on the cooling of power semiconductors. The simulation of multiple fault cases as well as highly inclined semiconductor placement gives insight into the severity of such. By a partitioning of the solder layer into 600 independent elements, the model is designed to allow a simulation of multiple solder faults. This enables the model to generate a high amount of training cases for a machine learning model for the detection of faults in the solder layer.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114205889","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
E. Wiss, A. Yuile, A. Schulz, Jens Müller, S. Wiese
{"title":"Reactive Die Bonding on LTCC Substrates – Analysis by CFD Simulation","authors":"E. Wiss, A. Yuile, A. Schulz, Jens Müller, S. Wiese","doi":"10.1109/EuroSimE56861.2023.10100772","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100772","url":null,"abstract":"To improve the understanding of reactive multilayer systems as a joining process computational fluid dynamics (CFD) simulations have been performed and compared with experimental measurements made using a pyrometer. These CFD simulations consist of a shoebox model which contains different layers. The layers in the model are an Ni/Al reactive multilayer, low temperature co-fired ceramic (LTCC) substrate and the surrounding air environment. To simulate the heat released by the multilayer system, a user defined function of probability density function (PDF) form was written for the heat source. The peak energy intensity, reaction width and reaction speed can be controlled via the PDF to adapt the simulation to the real model.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126944313","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
X. Hu, H.A. Martina, R. Poelma, J.L. Huang, H. Rijckevorsel, H. Scholten, E.C.P. Smits, W. V. van Driel, G.Q. Zhang
{"title":"Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device","authors":"X. Hu, H.A. Martina, R. Poelma, J.L. Huang, H. Rijckevorsel, H. Scholten, E.C.P. Smits, W. V. van Driel, G.Q. Zhang","doi":"10.1109/EuroSimE56861.2023.10100799","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100799","url":null,"abstract":"Resin-reinforced silver (Ag) sintering material is an effective and highly reliable solution for power electronics packaging. The hybrid material’s process parameters strongly influence its microstructure and pose a significant challenge in estimating its effective properties as a thin interconnect layer. This research demonstrates a novel 3D reconstruction methodology for the microstructural investigation of the resin-reinforced Ag sintering material from OverMolded Plastic (OMP) packages. Based on the reconstructed models with different sintering parameters (temperature and time), the fraction of Ag and Resin volume distribution, the connectivity of silver particles, and the tortuosity factors were estimated. A 99% connectivity of sintered Ag particles was achieved with various sintering conditions, such as 200°C for 2 hours, 200°C for 4 hours, and 250°C for 2 hours. However, coarsening of Ag particles was promoted when sintered at 250°C. Increasing the sintering time at 200°C had insignificant changes. The estimated tortuosity factor also indicated that sintering at 250°C provides the shortest heat transport path between the semiconductor die and the package substrate. In order to quantify the microstructural findings, the OMP packages’ thermal performance with different sintering conditions (temperature, time, and interconnect thickness) was experimentally assessed. Although the experimental measurements were less sensitive to the effective interface thermal resistances’, the measurement results show a good correlation with the microstructural analysis. Sintering the Resin-reinforced Ag sintering material at higher temperatures (250°C) seems to improve the package thermal performance, and increasing the sintering time at 200°C has a negligible effect.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124822446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Cao Zhibo, Pekkolay Baran, Okur Aslihan, Heusdens Bruno, Carta Corrado, Kaynak Mehmet
{"title":"An Advanced Finite Element Model of the Cu Pillar Solder Reflow Assembly","authors":"Cao Zhibo, Pekkolay Baran, Okur Aslihan, Heusdens Bruno, Carta Corrado, Kaynak Mehmet","doi":"10.1109/EuroSimE56861.2023.10100808","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100808","url":null,"abstract":"The recently emerged Cu pillar technology has drawn a lot of attention in the wafer-level packaging field due to its fine pitch and superior electrical performances. Flip-chipping Cu pillar dies to low-cost PCBs is considered a promising and cost-effective packaging approach. This paper focuses on developing a thermal-mechanical finite element model to identify how different Cu pillar and board configurations impact Cu pillar shear stresses. Furthermore, this model extracts shear stresses from Cu pillar solders in various positions, providing valuable information about Cu pillar shear strengths when compared to the visual inspection results of the package’s cross-section. This model is a significant step towards the further development and standardization of the Cu pillar flip-chip technology.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122480879","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
B. Vandevelde, R. Labie, R. Lauwaert, R. Dudek, P. Gromala, Michael Eichorst
{"title":"Strain Measurements and Thermo-Mechanical Simulation of SnAgCu vs. low melting point alloy (LMPA-Q) solder joints","authors":"B. Vandevelde, R. Labie, R. Lauwaert, R. Dudek, P. Gromala, Michael Eichorst","doi":"10.1109/EuroSimE56861.2023.10100841","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100841","url":null,"abstract":"Thermal cycling tests showed much higher thermal cycling lifetime for components soldered with a low melting point alloy (LMPA-Q), compared to the standard SnAgCu solder. This is not expected as due to its lower melting point, the LMPA-Q solder is deforming more and having higher creep strains during thermal cycling, in particular if the maximum temperature of the cycling is close to the melting temperature. These higher creep strains are not reflected in the time to fatigue failure.To better understand the physics of failure behaviour of both solders (LMPA-Q vs SnAgCu), the microstructural behaviour of both solders is analysed with scanning acoustic measurements (SEM) and the deformations of the solder joints during thermal cycling are measured using digital image correlation (DIC) method.Finally, the deformation and strain measurements are compared to thermo-mechanical simulations. The simulations also include the grain structures in the solder joints. The outcome reveals the importance of having grains with different orientation into the modelling to explain the outcome of the thermal cycling tests.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115664798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Borja Kilian, J. Gleichauf, Y. Maniar, O. Wittler, M. Schneider-Ramelow
{"title":"Finite Element-Based Monitoring of Solder Degradation in Discrete SiC MOSFETs","authors":"Borja Kilian, J. Gleichauf, Y. Maniar, O. Wittler, M. Schneider-Ramelow","doi":"10.1109/EuroSimE56861.2023.10100794","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100794","url":null,"abstract":"Many of the reliability methods used in power electronics require extensive experimental data, resulting in long product design cycles. This work focuses on developing a simulation-driven approach to assess the reliability of a discrete silicon carbide MOSFET by monitoring $2^{mathrm{n}mathrm{d}}$ level solder degradation under power cycling in the thermal and thermo-mechanical domains. Active power cycling tests are performed to determine the loading condition at which end-of-life is reached due to a 20% increase in thermal resistance. Numerical analysis using finite element simulations is conducted to gain a physical understanding of the failure criterion from a mechanical point of view. The proposed methodology aims to accelerate the quality assurance and product qualification processes of discrete power electronic devices.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131943728","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}