焊料空隙和倾斜对功率半导体冷却影响的高效模拟

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI:10.1109/EuroSimE56861.2023.10100817

Nils-Malte Jahn, M. Pfost

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引用次数: 2

摘要

在本研究中，提出了一个高效且足够详细的仿真模型来研究焊点空隙对功率半导体冷却的影响。多种故障情况的模拟以及高度倾斜的半导体放置可以深入了解这种情况的严重性。通过将焊料层划分为600个独立的元素，该模型可以模拟多个焊料故障。这使得该模型能够为机器学习模型生成大量的训练案例，用于检测焊料层中的故障。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Efficient Simulation of the Effect of Solder Voids and Tilting on the Cooling of Power Semiconductors

In this research, a time-efficient and sufficiently detailed simulation model is presented to study the effect of solder voids on the cooling of power semiconductors. The simulation of multiple fault cases as well as highly inclined semiconductor placement gives insight into the severity of such. By a partitioning of the solder layer into 600 independent elements, the model is designed to allow a simulation of multiple solder faults. This enables the model to generate a high amount of training cases for a machine learning model for the detection of faults in the solder layer.

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来源期刊

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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