Reduction of empiricism in the solder joint reliability assessment of QFN packages by using thermo-mechanical simulations

M. Soestbergen, R. Roucou, M. Rebosolan, J.J. M Zaal
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Abstract

To ensure sufficient field life of solder joints, standardized stress tests are performed during the development phase of products, where calibrated thermo-mechanical simulations are frequently used to ensure a potentially sufficient robustness margin. In this work we show how simulations are calibrated for the QFN (Quad Flat No leads) package family. Using thorough failure analysis, we found that for QFN packages two types of solder joint failure modes can occur. The first failure mode is a brittle fracture through the intermetallic region near the solder interface, the other mode is a crack through the bulk of the solder. In the simulations we handle both failure modes using two different failure metrics. For the brittle fractures we analyzed the volumetric strain energy density in a thin region near the interface. For bulk fails we computed the volume-averaged inelastic strain energy density across the whole solder joint. Using both metrics we found a correlation between simulation and experimental results, where Miner’s rule was used to correlate the results of any non-functional anchor joint to the experimental results of the functional joints. The correlation can be used to predict the solder performance upfront in the design phase, and thus reduce the experimental effort during product development.
利用热力学模拟减少QFN封装焊点可靠性评估的经验主义
为了确保焊点有足够的现场使用寿命,在产品的开发阶段进行标准化的应力测试,其中经常使用校准的热机械模拟来确保潜在的足够的鲁棒性裕度。在这项工作中,我们展示了如何为QFN (Quad Flat No引线)封装家族校准模拟。通过彻底的失效分析,我们发现对于QFN封装,可以发生两种类型的焊点失效模式。第一种失效模式是通过靠近焊料界面的金属间区发生脆性断裂,另一种失效模式是通过大部分焊料发生裂纹。在模拟中,我们使用两种不同的失效度量来处理这两种失效模式。对于脆性断裂,我们分析了界面附近薄区域的体积应变能密度。对于整体失效,我们计算了整个焊点的体积平均非弹性应变能密度。使用这两个指标,我们发现模拟和实验结果之间存在相关性,其中Miner规则用于将任何非功能锚固关节的结果与功能关节的实验结果关联起来。该相关性可用于在设计阶段预先预测焊料性能,从而减少产品开发期间的实验工作量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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