2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

{"title":"Application of AI-enabled Simulation in Power Package Development","authors":"H. Fan, Peilun Yao, Haibin Chen","doi":"10.1109/EuroSimE56861.2023.10100811","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100811","url":null,"abstract":"The design of power packages with both high efficiency and high-power density performance while maintaining the highest possible reliability is a challenge. During development for power package, design of experiment (DOE) by simulation can effectively shorten the design cycle, reduce costs, and effectively optimize the packaging structure. However, the simulation analysis results are highly dependent on the individual researcher and are only part of overview of factor. Especially, as the package size continuously decrease for high-density designs, there are lots of challenge areas, like thin die pick-up process, material optimization to enhance process and reliability performance. Maching learning (ML) within the field of Artificial Intelligence (AI) simulation can be very effective tools to help address these challenges.In this paper, application of ML algorithms and enabled simulation for die pick-up process and reliability testing related to power device are discussed. For thin die pick-up process, Bayesian optimization was used to optimize the parameters to achieve the lowest die stress under a given condition. An automatic molding compound selection framework is proposed to generate the optimal material properties of epoxy molding compound (EMC) properties for solder joint reliability. Through these cases, it has been demonstrated that the AI-enabled simulation can be utilized to significantly improve parameter optimization and material selection for robust power device development.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"52 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132328385","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effect of Elastic-Plastic Anisotropy of Solder Grains on Variability of Cyclic Mechanical Bending Durability in SAC305 CSP Assembly","authors":"Aniket Bharamgonda, A. Dasgupta, A. Deshpande, T. Hauck, Yaxiong Chen","doi":"10.1109/EuroSimE56861.2023.10100850","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100850","url":null,"abstract":"SAC solder joints contain a few large grains and are hence termed oligocrystalline. Solder joints represent heterogeneous anisotropic behavior which affect durability of solder joint during thermal and mechanical loading conditions. In this paper, variability in durabiity of solder joints under cyclic mechanical bending of CSP assemblies was studied. A global 3D slice model of CSP package was used anddisplacement were transferred to a more detailed local model of the critical solder joint, using a submodeling approach. Further simulations were conducted on this critical CSP joint. Local model results were compared with global model.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125330178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Simulation of Cu bulge-out by cyclic Cu surface diffusion FEM in Cu/SiCN hybrid bonding","authors":"Yan-Wen Tsau, J. Messemaeker, Mario Gonzalez, M. Seefeldt, E. Beyne, I. Wolf","doi":"10.1109/EuroSimE56861.2023.10100784","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100784","url":null,"abstract":"Elastic strain energy density (ESED) driven surface self-diffusion was previously identified as the mechanism underlying the Cu bulge-out phenomenon in wafer-to-wafer (W2W) hybrid bonding structures with unequal sized pads. Being able to predict the Cu bulge-out allows widening the CMP process window and increasing the yield. In this paper, an iterative finite element method (FEM) model is developed to track the evolution of ESED on the Cu pad surface and the corresponding Cu surface diffusion flow to predict the Cu bulge-out.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"56 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126768202","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Power Semiconductor Die Passivation Layer Stress Mechanism Investigation and optimization by Numerical Analysis","authors":"Zhou Zhou, H. Fan, Adam Brown","doi":"10.1109/EuroSimE56861.2023.10100807","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100807","url":null,"abstract":"As the frontiers of power semiconductor package are constantly driven higher, faster voltage switching is associated with extreme thermal variation, which can cause package individual components to behave differently to each other, and potentially create substantial thermomechanical stress between them. A comprehensive assessment of such stress reliability of the brittle or ductile thin layers is necessary to enable higher performance products complying with industrial standard of wider application scenarios.Present study discusses Thermal Cycling Test (TCT) stress formation mechanism and optimization direction for power package both from package level design that includes clip topologies and Epoxy Molding Compound (EMC) properties, and from die structure level polyimide layer application. With ANSYS Workbench simulation tool, passivation layer stress distributions are obtained and compared with their deformation feature as well as with package bending trend during TCT. Stress concentration mechanisms and optimization directions can be revealed from those mapping relations. optimized package design and die structure design that follow stress relief mechanisms are proposed and numerically evaluated. Thereby designed experiment provides validation for both simulation results and stress concentration/mitigation mechanisms.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121616430","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Lifetime modeling of copper metallization for SiC power electronics","authors":"Daniel Losbichler, M. Klingler, S. Orso, B. Wunderle","doi":"10.1109/EuroSimE56861.2023.10100835","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100835","url":null,"abstract":"Changing the metallization material for power electronics from aluminum to copper to increase the lifetime needs a deeper understanding of how the materials behave during production and service. Electrochemical deposited copper (ECD) and sputtered aluminum layers are characterized. Nanoindentation measurements in combination with reverse simulation is used to fit material models. Fatigue experiments show that higher strength and stain hardening in copper layers reduces the fatigue damage on free surfaces. The damage behavior remains similar, dislocation movement on slip-planes out of the surface. Wafer bow measurements are used to characterize the stress development in the layers up to 400°C. For annealed ECD copper the intrinsic stress is higher compared to AlCu.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"520 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123049080","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Predictive thermo-mechanical models for the quantification of electro-mechanical interactions during production and field-life","authors":"J. Zaal, C. He, J. Claes, J. V. Herk, A. Adojutelegan, X. Cheng","doi":"10.1109/EuroSimE56861.2023.10100836","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100836","url":null,"abstract":"Many modern appliances rely on a significant number of high-performance-mixed-signal ICs. Circuit level trimming is often needed for these analog circuits. The piezoresistive effect can introduce undesired or unexpected shifts in the electrical performance after packaging. This effect can be studied by means of simulation using a combination of thermo-mechanical and analog simulation.In this study packaged polysilicon resistor test structures are simulated and measured and the results are compared against each other. A good agreement is found over the temperature range studied. Shifts during reflow and thermal cycling are studied and the effect of delamination on the shifts is included.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115571965","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Failure Prediction and Analysis of an IGBT Module for Industrial Applications Subjected to Passive and Power Cycling","authors":"R. Dudek, A. Otto, R. Döring, Anu Mathew, Xing Liu, S. Rzepka","doi":"10.1109/EuroSimE56861.2023.10100806","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100806","url":null,"abstract":"The thermo-mechanical reliability of an industrial power module containing IGBTs with soldered die and module attachment and aluminum bonding wires has been investigated. In this kind of power packaging, die attachment, module attachment, and bonding wires attachment can be critical failure modes. It was one aim of the investigation to analyze these failures when the modules are subjected to different kinds of passive and power cycling. Furthermore, prediction of these failures based on finite element (FE) studies are addressed. Coupled (FE-) analyses are reported to understand the thermo-mechanical stresses in the assembly. Verification of evaluation methodologies to predict cyclic damage are in the focus of the paper. Physics-of-failure (PoF) based lifetime prediction is applied for a power stack die attach with soft solder between chip and substrate and between substrate and base-plate. An easy-to-use Coffin-Manson type failure criterion is given based on averaged cyclic creep strain and dissipation density. At the wire bonding interfaces bi-material notch effects cause stronger interface stress singularity, and therefore, damage mechanics criteria already proposed in [1] are updated and applied. Cyclic damage is calculated by the Cohesive Zone Method (CZM) and critical cycle numbers are estimated from that by a modified Paris law. The predictive laws for both thin solder layers and heavy Al bonds are compared to testing results and shown to agree well.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122843405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Hydrolysis Mechanism Analysis of (Ca, Sr)AlSiN₃:Eu²⁺ Red Phosphor Aged Under Pressure Cooker Test and 85°C&85%RH Test: Kinetics Modeling and First-principles Calculation","authors":"Minzhen Wen, Baotong Guo, Shanghuan Chen, Xiao Hu, Xuejun Fan, Guoqi Zhang, Jiajie Fan","doi":"10.1109/EuroSimE56861.2023.10100750","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100750","url":null,"abstract":"The (Ca, Sr) AlSiN₃:Eu²⁺(CSASN:Eu) red phosphor is widely used to improve color rendering of high-power phosphor-converted lighting diode (pc-WLED), but it is always unstable under high temperature and high humidity environments. Therefore, the studies on the temperature and humidity resistance of red phosphors and their aging mechanism have become essential to evaluate its reliability in harsh applications. In this paper, the pressure cooker test (PCT) and 85°C&85% RH aging test were carried out for the CSASN:Eu red phosphors. And, its hydrolysis reaction-driven degradation mechanism was simulated and analyzed based on first-principle calculation, in which the optimized adsorption of simplified CaAlSiN3(CASN) and H2 O was simulated based on Density Function Theory (DFT) and the specific aging process was analyzed by the charge density difference and ab initio molecular dynamics (AIMD). The experimental results showed that the photoluminescence performance of CSASN:Eu red phosphor dropped gradually and finally disappeared under PCT aging, and its temperature-dependent degradation kinetics followed the Arrhenius model well. Meanwhile, the simulation results indicate that the CASN, reacted with H2 O when the H atoms had a tendency to approach N atoms. Both the temperature and humidity could accelerate the hydrolysis reaction rate.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129419110","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Validation of the thermal path with one phase liquid cooling for HPC in harsh environment","authors":"T. Grün, D. May, Hubert Straub, Gromala Przemyslaw Jakub, Willem Verleysen, B. Wunderle","doi":"10.1109/EuroSimE56861.2023.10100823","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100823","url":null,"abstract":"Autonomous driving calls for on-board HPC modules requiring enhanced and reliable (liquid) cooling solutions under harsh environmental conditions. This paper proposes different approaches to increase the performance of liquid cooled heat sink designs. We compare different internal structures and novel designs which are only manufacturable by 3D printing. Staggered pin-fin and manifold designs are benchmarked against micro-channel based cold plates w.r.t. pressure drop and convective thermal resistance and validated on a real power-SiP realised as a large die on organic interposer as well as on a ceramic heater.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128512559","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"AI and Feature-Vector Based Damage Monitoring and Remaining Useful-Life Assessment for Electronics Assemblies in Mechanical Shock and Vibration","authors":"P. Lall, Tony Thomas","doi":"10.1109/EuroSimE56861.2023.10100747","DOIUrl":"https://doi.org/10.1109/EuroSimE56861.2023.10100747","url":null,"abstract":"In order to ensure uninterrupted operation over time-in-service, progressive assessment of damage accrual and remaining useful life is needed to allow for early identification of impending failure. This paper proposes Prognostics Health Management methods for feature vector-based assessment of damage initiation and progression in electronic systems. The methods can be used to detect impending failures in mission-critical electronics while they are in operation or to assess mission readiness before deployment. Previous research in the field has focused on using fuses and canaries to detect impending failure. Prior implementation of data-driven methods frequently disregards failure mechanics. A method for assessing evolving damage in complex systems with nonlinear material behavior has been presented. For various mechanical shock and vibration levels, feature vectors have been identified for predicting remaining useful life. Damage progression was investigated in test vehicles made from various solder interconnects, including SAC105 and SAC305, with the same assembly geometry and architecture. The changes in feature vectors caused by differences in solder material were also investigated. In order to create meaningful data vectors for correlation with the underlying damage progression in pristine and aged assemblies, feature-vector engineering has been pursued. The feature vector selected from the strain signal’s time and frequency domain analysis is modeled using the Long Short-term Memory (LSTM) deep learning technique to predict the packages’ remaining useful files during the drop. Validation cases for the feature vectors identified in the study have been presented by correlating the plastic work predicted by finite element simulation with that predicted by LSTM. Furthermore, the prediction of remaining useful life has been correlated with experimentally measured time to failure.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124580586","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}