PCBA reliability simulation in the cloud

Harald Ziegelwanger
{"title":"PCBA reliability simulation in the cloud","authors":"Harald Ziegelwanger","doi":"10.1109/EuroSimE56861.2023.10100837","DOIUrl":null,"url":null,"abstract":"Printed circuit board assemblies (PCBAs) are geometrically complex components. Because of the geometrical complexity which is mainly defined by complex PCB layouts and the complex shape of solder joints, PCBAs are difficult to simulate and a simulation software that can consider all geometric details has not been proposed yet. Thus, a simulation software is proposed which can build finite-element models of PCBAs including all geometrical details down to the level of solder joints and vias and which can be efficiently scaled on cloud infrastructure to solve huge simulation models.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EuroSimE56861.2023.10100837","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Printed circuit board assemblies (PCBAs) are geometrically complex components. Because of the geometrical complexity which is mainly defined by complex PCB layouts and the complex shape of solder joints, PCBAs are difficult to simulate and a simulation software that can consider all geometric details has not been proposed yet. Thus, a simulation software is proposed which can build finite-element models of PCBAs including all geometrical details down to the level of solder joints and vias and which can be efficiently scaled on cloud infrastructure to solve huge simulation models.
云中的PCBA可靠性仿真
印刷电路板组件(pcb)是几何上复杂的组件。由于PCB的几何复杂性(主要体现在复杂的PCB布局和复杂的焊点形状上),PCB的仿真非常困难,目前还没有一种能够考虑所有几何细节的仿真软件。因此,提出了一种仿真软件,该软件可以构建pcb的有限元模型,包括所有几何细节,直至焊点和过孔的水平,并且可以在云基础设施上有效地扩展以解决巨大的仿真模型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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