{"title":"PCBA reliability simulation in the cloud","authors":"Harald Ziegelwanger","doi":"10.1109/EuroSimE56861.2023.10100837","DOIUrl":null,"url":null,"abstract":"Printed circuit board assemblies (PCBAs) are geometrically complex components. Because of the geometrical complexity which is mainly defined by complex PCB layouts and the complex shape of solder joints, PCBAs are difficult to simulate and a simulation software that can consider all geometric details has not been proposed yet. Thus, a simulation software is proposed which can build finite-element models of PCBAs including all geometrical details down to the level of solder joints and vias and which can be efficiently scaled on cloud infrastructure to solve huge simulation models.","PeriodicalId":425592,"journal":{"name":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-04-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EuroSimE56861.2023.10100837","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Printed circuit board assemblies (PCBAs) are geometrically complex components. Because of the geometrical complexity which is mainly defined by complex PCB layouts and the complex shape of solder joints, PCBAs are difficult to simulate and a simulation software that can consider all geometric details has not been proposed yet. Thus, a simulation software is proposed which can build finite-element models of PCBAs including all geometrical details down to the level of solder joints and vias and which can be efficiently scaled on cloud infrastructure to solve huge simulation models.