Leadframe-Epoxy Moulding Compound Adhesion: a Micromechanics-driven Investigation

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2023-04-17 DOI:10.1109/EuroSimE56861.2023.10100792

Alessandro Della Porta, S. Mariani, M. Rovitto, L. Andena, Samuele Zalaffi

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引用次数: 1

Abstract

A typical reliability issue of electronic packages is the decohesion between the encapsulant material, the Epoxy Molding Compound (EMC), and the leadframe. As the EMC is a microstructured composite material, the present computational study is aimed at understanding the influence of the EMC microstructure on the macroscopic mechanical and adhesive properties. Statistical Volume Elements (SVEs) are employed to this purpose, with a random arrangement of spherical particles of varying diameter to represent the filler volume fraction and size distribution. Mechanical properties of the neat polymeric matrix are obtained from experimental data relevant to the EMC through an inverse homogenization scheme, and the effect of a varying filler content is investigated. Finally, microstructural effects on the adhesion are studied with micro-scale models of the leadframe-matrix-filler system, accounting for the leadframe-matrix adhesion through a cohesive approach. The effects of filler content, substrate roughness, and intrinsic adhesive properties on the effective traction-separation law are assessed.

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引线框架-环氧成型复合材料粘接:微观力学驱动的研究

电子封装的一个典型的可靠性问题是封装材料、环氧成型化合物(EMC)和引线框架之间的脱粘。由于电磁兼容材料是一种微结构复合材料，本计算研究旨在了解电磁兼容材料微观结构对宏观力学性能和粘接性能的影响。采用统计体积元(SVEs)来实现这一目的，随机排列不同直径的球形颗粒来表示填料的体积分数和尺寸分布。利用电磁兼容相关的实验数据，通过反均质方案获得了整齐聚合物基体的力学性能，并研究了填料含量的变化对其力学性能的影响。最后，利用引线框架-基质-填料体系的微观尺度模型研究了微观结构对粘结性的影响，并通过内聚方法对引线框架-基质的粘结性进行了计算。评估了填料含量、基材粗糙度和内在粘附性能对有效牵引-分离规律的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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