Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)最新文献_第7页

Lead free alloys for flip chip bumping 倒装芯片碰撞用无铅合金

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916560

E. Jung, R. Aschenbrenner, C. Kallmayer, P. Coskina, H. Reichl

{"title":"Lead free alloys for flip chip bumping","authors":"E. Jung, R. Aschenbrenner, C. Kallmayer, P. Coskina, H. Reichl","doi":"10.1109/ISAOM.2001.916560","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916560","url":null,"abstract":"In addition to the ecological and electrical aspects of area array packages, there is a need to develop new solders with similar process characteristics and usage cost to Pb/Sn solders, but which are lead free and have improved mechanical properties and microstructural stability. As operating temperatures increase, standard alloys are unable to withstand the increased fatigue caused by the thermal cycling. Current lead-tin solders lack shear strength, creep resistance and thermal mechanical fatigue resistance. A solder which exhibits enhancements of these properties is crucial in automotive and other high-reliability products and high-temperature assemblies. In electronic packaging, it is common practice to solder the various levels of the package with different solders of different melting points so that the soldering of each successive level or step does not remelt the previously soldered joints. Depending on the particular applications, the most suitable solder alloys for area array packages (flip chip, CSP, BGA) are presented in this paper. Initial reliability results are also given.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130998450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Getters: micromolecular scavengers for packaging [MEMS] 捕集剂:用于封装的微分子清除剂[MEMS]

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916575

M. Previti, K. Gilleo

引用次数: 4

Flux/underfill compatibility study for flip-chip manufacturing 倒装芯片制造的助熔剂/底填料相容性研究

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916545

T. Yamashita, T. Jiang

引用次数: 2

Influence of titanate and zirconate coupling agents in epoxy underfill material 钛酸盐和锆酸盐偶联剂对环氧底填料性能的影响

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916594

S. Luo, T. Yamashita, C. Wong

引用次数: 0

A method to quantify the surface insulation resistance performance of glob tops exposed to different temperature/humidity combinations 一种量化暴露在不同温度/湿度组合下的球顶表面绝缘电阻性能的方法

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2000-10-01 DOI: 10.1109/ISAOM.2001.916551

P. Tomlins, L. Zou

引用次数: 0

Rubber stamped plastic circuits for electronic paper 电子纸用胶印塑料电路

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 1900-01-01 DOI: 10.1109/ISAOM.2001.916556

J. Rogers, K. Baldwin, Zhenan Bao, A. Dodabalapur, V. R. Raju, J. Ewing, K. Amundson

引用次数: 2

High frequency measurement of isotropic conductive adhesives 各向同性导电胶粘剂的高频测量

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 1900-01-01 DOI: 10.1109/ISAOM.2001.916583

Zhuqing Zhang, S. Liong, C. Wong

引用次数: 0

WASPP Program: advanced passivation for advanced packages and harsh environments WASPP计划:先进封装和恶劣环境的先进钝化

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 1900-01-01 DOI: 10.1109/ISAOM.2001.916550

C. Reusnow, S. Wheelock

引用次数: 0

New developments in single pass reflow encapsulant for flip chip application 倒装芯片用单通流封装剂的新进展

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 1900-01-01 DOI: 10.1109/ISAOM.2001.916552

J. Liu, R. Kraszewski, Xin Lin, L. Wong, S. Goh, J. Allen

{"title":"New developments in single pass reflow encapsulant for flip chip application","authors":"J. Liu, R. Kraszewski, Xin Lin, L. Wong, S. Goh, J. Allen","doi":"10.1109/ISAOM.2001.916552","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916552","url":null,"abstract":"This paper introduces a series of single pass reflow encapsulants that require no post curing after solder bump reflow. Acting as a flux and an encapsulant, this product performs two functions. First, the material activates the solder bump and metallic bond pad during solder reflow to establish the interconnection between the die and substrate. Second, while this material is being cured, it forms a mechanical bond between the surface of the die and substrate. This product allows processing of normal surface mount component packages concurrently with flip chip, CSPs or BGAs under the standard surface mount reflow profile. Such a process eliminates capillary underfilling and curing time. The product's solderability is robust and high yield; the parts are reliable after thermal shock testing. We have employed DSC, TMA, DMA and shear test techniques to investigate the properties of the material. These properties include influence of filler loading level, curing reflow profile, percentage cure, glass transition temperature (T/sub g/), coefficient of thermal expansion (CTE), modulus and die shear adhesion.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"254 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116737833","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Chip size BGA packaging for high performance memory 用于高性能存储器的芯片尺寸BGA封装

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 1900-01-01 DOI: 10.1109/ISAOM.2001.916558

V. Solberg

引用次数: 0