一种量化暴露在不同温度/湿度组合下的球顶表面绝缘电阻性能的方法

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2000-10-01 DOI:10.1109/ISAOM.2001.916551

P. Tomlins, L. Zou

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引用次数: 0

摘要

通常，球形顶部密封剂和填充料供应商向其材料用户提供的唯一信息是表面绝缘电阻的单一值。该数据提供的有关密封剂在其使用寿命中可能遇到的各种不同湿度/温度条件下的性能的信息很少。本程序描述了在广泛的环境条件下表征封装材料性能的一种简单方法。所得数据可用于评估不同制造商的配方或类型的密封剂分配到不同的板饰面或不同的板材料的性能。

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A method to quantify the surface insulation resistance performance of glob tops exposed to different temperature/humidity combinations

Often the only information that suppliers of glob top encapsulant and dam and fill materials provide for users of their materials is a single value of surface insulation resistance. This datum provides very little information about the encapsulant performance over the wide range of different humidity/temperature conditions that it may encounter in its service life. This procedure describes a simple method for characterising the performance of encapsulant materials over a broad range of environmental conditions. The resultant data can be used to assess the performance of different manufacturers' formulations or types of encapsulant dispensed on to different board finishes or on to different board materials.

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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

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