Chip size BGA packaging for high performance memory

Abstract

Chip-scale or chip-size array packaging is currently in wide use throughout the industry, providing the solutions for applications that enable a reduced product size-to-function ratio. Portable or hand-held electronics is a natural target. Digital cameras and camcorders, for example, must consider ease of use, lighter weight and performance. Telephones, pagers, personal communicators, palm top computers, industrial and automotive electronics, personal GPS, medical and diagnostic products, are all viable candidates for more efficient device miniaturization. Memory devices are the first commodity type products in the market to adapt CSP in high volume; however, DSP, controllers, CPUs and any number of application specific IC devices are also prime candidates for chip-scale packaging.