J. Rogers, K. Baldwin, Zhenan Bao, A. Dodabalapur, V. R. Raju, J. Ewing, K. Amundson
{"title":"Rubber stamped plastic circuits for electronic paper","authors":"J. Rogers, K. Baldwin, Zhenan Bao, A. Dodabalapur, V. R. Raju, J. Ewing, K. Amundson","doi":"10.1109/ISAOM.2001.916556","DOIUrl":null,"url":null,"abstract":"This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (/spl mu/CP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (/spl sim/1 /spl mu/m) of the printed elements, the large area coverage (/spl sim/1 sq ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISAOM.2001.916556","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (/spl mu/CP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (/spl sim/1 /spl mu/m) of the printed elements, the large area coverage (/spl sim/1 sq ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.