WASPP计划:先进封装和恶劣环境的先进钝化

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 1900-01-01 DOI:10.1109/ISAOM.2001.916550

C. Reusnow, S. Wheelock

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引用次数: 0

摘要

军用电子部件变得不可用，军事系统被迫使用商业塑料封装微电路(PEMs)。即使在非常低的湿度水平下，由于长期暴露，PEMs也容易受到与水分有关的故障机制的影响。一些军事系统必须在储存30年后才能可靠运行。本报告涵盖了陆军航空和导弹司令部项目的最新成果，该项目提供近密封晶圆级密封器件，也有利于半导体行业。该工艺为先进的小型封装提供了希望，这些封装必须在恶劣的工业、汽车或电信环境中使用，而且几乎没有塑料保护。该演讲包括该计划的最新发展，包括实现“爆米花”的解决方案，以及化合物半导体器件显著提高速度的潜力。

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WASPP Program: advanced passivation for advanced packages and harsh environments

Military electronic parts are becoming unavailable and military systems are forced to use commercial plastic encapsulated microcircuits (PEMs). PEMs are susceptible to moisture related failure mechanisms occurring from long-term exposure, even at very low humidity levels. Some military systems must operate reliably after 30 years in storage. This presentation covers the latest results of an Army Aviation and Missile Command program to provide near hermetic wafer level sealed devices that also benefits the semiconductor industry. The process shows promise for advanced small-scale packages with little plastic protection that must operate in harsh industrial, automotive, or telecommunications environments. The presentation includes the latest developments of the program, including enabling solutions for "popcorning" and the potential for significant speed improvements in compound semiconductor devices.

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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

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