Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)最新文献_第6页

Spherical silicon 1 mm device and its clustering 球形硅1mm器件及其聚类

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916554

N. Takeda

引用次数: 7

Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill 基于细观力学的非均质下填料电子封装组件界面应力分析与断裂

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916582

Ji Eun Park, I. Jasiuk, A. Zubelewicz

引用次数: 3

Behavior of electronically conductive filled adhesive joints under cyclic loading. I. Experimental approach 循环荷载作用下导电填充胶粘接头的性能。一、实验方法

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916540

R. Gomatam, Erol Sancaktar, D. Boismier, D. Schue, I. Malik

{"title":"Behavior of electronically conductive filled adhesive joints under cyclic loading. I. Experimental approach","authors":"R. Gomatam, Erol Sancaktar, D. Boismier, D. Schue, I. Malik","doi":"10.1109/ISAOM.2001.916540","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916540","url":null,"abstract":"Electronically conductive adhesives have received a great deal of attention in recent years for interconnection applications. Although they have great potential for being a more efficient and less costly alternative to solder joining in electronic components, there are still a number of problems in the areas of durability and design to meet specific needs. Unfortunately, the usefulness of this technique has been limited due to lack of understanding of environmental effects such as exposure to high moisture and/or temperature during mechanical fatigue loading, as faced in the service environment. Furthermore, the environmental effects mentioned may, themselves be acting in cyclic form. The objective of this paper is to add to the fundamental understanding of fatigue degradation in these joints, and to identify the dominant fatigue mechanisms for different service environment regimes, including cyclic mechanical loading under elevated temperature, and humidity. The scope of this study involves in-depth analysis and assessment of fatigue mechanisms and fatigue modes for a wide variety of parameters, i.e. humidity, temperature, pre-conditioning, stress ratio, and frequency. Failure surfaces are examined to identify degradation mechanisms in the adhesive interlayer by optical and SEM techniques. Measurements and observations are related to damage processes, failure modes, and the results are assessed with respect to the relevance of existing failure theories and criteria. It is expected that much improved fatigue life, fail-safe capability, and reduced manufacturing costs will be realized for electronically conductive adhesives.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114840629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Assuring reliable PEMs by statistical monitoring of thermal and mechanical properties of molded plastic parts sampled from production 通过统计监测从生产中取样的模塑件的热性能和机械性能，确保可靠的PEMs

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916574

R. Lowry, K. L. Hanley

{"title":"Assuring reliable PEMs by statistical monitoring of thermal and mechanical properties of molded plastic parts sampled from production","authors":"R. Lowry, K. L. Hanley","doi":"10.1109/ISAOM.2001.916574","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916574","url":null,"abstract":"Plastic encapsulated microcircuits (PEMs) are assembled on high-volume production lines. Reliability expectations for such products are increasingly demanding. Thermal and mechanical properties of plastic encapsulants used to manufacture PEMs, and alterations to these by molding processes, are among the factors which influence assembled product reliability. Important properties include the filler content (typically 65-85% by weight) of the material, glass transition temperature (T/sub g/), and coefficients of thermal expansion (CTEs; alpha 1, measured below T/sub g/, and alpha 2, measured above T/sub g/). These properties and the changes that occur in them during processing, can alter mechanical stresses and other factors influencing performance of assembled parts. While filler content is a raw material lot-oriented variable, T/sub g/ and CTEs of the finished molded units are influenced both by the manufacturer's formulation of the raw material lot and by assembly process variation. This paper describes the variability of T/sub g/, CTE, and filler content observed for more than one thousand assembled lots of PEMs. Product molded in six different plastic mold compounds was (and still is) sampled on a weekly basis over several years. Statistical control charts quantifying the variability observed in the material properties are presented. Trending and out-of-control occurrences are discussed. This database has proved useful not only in guiding plastic assembly operations in process control and improvement, but also in communicating the extent of control of the PEM assembly process to customers.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134009711","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Photosensitive polynorbornene as a dielectric material for packaging applications 光敏聚降冰片烯作为介质材料的包装应用

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916596

Yiqun Bai, P. Chiniwalla, P. Kohl, S. Bidstrup-Allen

引用次数: 0

Evaluation of reworkable underfills for area array packaging encapsulation 区域阵列封装中可重新填充的评价

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916544

Lejun Wang, S. Kang, Haiying Li, D. Baldwin, C. Wong

{"title":"Evaluation of reworkable underfills for area array packaging encapsulation","authors":"Lejun Wang, S. Kang, Haiying Li, D. Baldwin, C. Wong","doi":"10.1109/ISAOM.2001.916544","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916544","url":null,"abstract":"Underfill is a polymeric material used in flip-chip devices to fill the gap between the IC chip and the organic board, encapsulating the solder joints. It enhances flip-chip device reliability by distributing thermo-mechanical stresses caused by the coefficient of thermal expansion (CTE) mismatch between chip and board evenly over the whole package. Current underfills are mainly epoxy-based materials that are not reworkable after curing, which is an obstacle to flip-chip technology development. Not only is reworkable underfill a key material to address the nonreworkability of flip-chip packages, it can also be used to enhance the reliability of ball grid array (BGA) and chip scale package (CSP) devices without sacrificing their good reworkability feature. The objective of this study is to evaluate process viability, material performance, and reliability of reworkable underfills for board level encapsulation of BGA, CSP and flip-chip packages. Both commercial and in-house developed reworkable underfills are also included in this study. For comparison, three commercial nonreworkable underfills are also included as baseline materials. It is found that certain reworkable underfills can provide similar thermal shock reliability to the flip chip test vehicle as to the baseline underfills. The effect of the underfills on board-level BGA and CSP reliability is largely dependent on the internal structure of the BGA/CSP components, but in general reworkable underfills improve the reliability of these components. In this paper, details of reliability assessment and failure mode analysis are presented and discussed.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"348 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123547014","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Effective applications of computer-vision techniques in packaging design concept evaluation 计算机视觉技术在包装设计概念评价中的有效应用

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916576

Hua Lu, J. Zhou

{"title":"Effective applications of computer-vision techniques in packaging design concept evaluation","authors":"Hua Lu, J. Zhou","doi":"10.1109/ISAOM.2001.916576","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916576","url":null,"abstract":"In packaging design concept verification, interpretations of data obtained from test vehicles are preferably supported by physics based analysis. This is vital when correlation between the thermal/mechanical test data and results from accelerated life testing is sought in order to predict the service life of a prototype. A proposed approach that integrates experimental and analytical procedures has been devised for such analyses. A feature of the approach is the wide variety of the measured data. Other than the test parameters, the approach collects temperature and time dependent deformation data at board, component and interconnect levels. Measurements in this work include surface warpage, in-plane displacements, rigid-body rotation and strains, assembling or residual stress/strain, failure loads and strength limits, etc. From the raw data, further quantities were deduced by applying the theories of beams/plates and material constitutive relations to further enrich the database. Inferred data include surface curvature, cross-sectional bending moment and shearing force, stress, strain rate and strain energy density, etc. The data variety allows better confirmation of the consistency among test results obtained with different techniques. It also facilitates applications of different theories for life prediction and failure mode and root-cause diagnosis. The comparison of different model predictions for same problem is aimed to provide a guide to the reliability model selection and application. This paper presents the experimental and analytical procedures together with some application examples to illustrate the approach.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124521428","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Syntheses and characterizations of a controlled thermally degradable epoxy resin system for electronic packaging 电子封装用可控热降解环氧树脂体系的合成与表征

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916587

Haiying Li, Lejun Wang, C. Wong

{"title":"Syntheses and characterizations of a controlled thermally degradable epoxy resin system for electronic packaging","authors":"Haiying Li, Lejun Wang, C. Wong","doi":"10.1109/ISAOM.2001.916587","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916587","url":null,"abstract":"In flip-chip technology, reworkable underfill development has been key to the recovery of highly integrated board assembly designs by replacing defective chips. This paper reports the synthesis, formulation and characterization of two new diepoxides containing secondary and tertiary ester linkages that are thermally degradable below 300/spl deg/C. The secondary and tertiary ester diepoxides were synthesized in three and two steps, respectively. The compounds were characterized via NMR and FTIR spectroscopy, and formulated into underfills with anhydride hardener and imidazole catalyst. A dual-epoxy system was also formulated using tertiary ester diepoxide and an aliphatic diepoxide, ERG-4221E, with the same hardener and catalyst. The curing kinetics were studied by DSC. Thermal properties of cured samples were studied by DSC, TGA and thermomechanical analysis (TMA). The dual-epoxy system showed a viscosity of 18.7, and 0.87 Poise at 25/spl deg/C and 190/spl deg/C, respectively. The cured secondary, tertiary and dual-epoxy formulas showed decomposition temperatures around 265/spl deg/C, 190/spl deg/C and 220/spl deg/C, glass transition temperatures (T/sub g/) around 120-140/spl deg/C, 110-157/spl deg/C and 140-157/spl deg/C, and CTE of 70 ppm//spl deg/C, 72 ppm//spl deg/C and 64 ppm//spl deg/C below their T/sub g/, respectively. The shear strength of the cured dual-epoxy system decreased quickly upon being aged at 230/spl deg/C. Reworkability tests showed that removal from the board of a chip underfilled with this material was easy and the board residue could be removed with a mechanical brush without obvious damage to the solder mask. In summary, the synthesized tertiary epoxide can be used as a reworkable underfill for flip-chip applications.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"221 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123868998","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

New dicing and thinning concept improves mechanical reliability of ultra thin silicon 新的切丁和减薄概念提高了超薄硅的机械可靠性

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916555

C. Landesberger, G. Klink, G. Schwinn, R. Aschenbrenner

引用次数: 60

Material characterization of high dielectric constant polymer-ceramic composite for embedded capacitor to RF application 射频嵌入式高介电常数聚合物-陶瓷复合材料的材料特性

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 2001-03-11 DOI: 10.1109/ISAOM.2001.916589

Y. Rao, Jireh Yue, Ching-ping Wong

{"title":"Material characterization of high dielectric constant polymer-ceramic composite for embedded capacitor to RF application","authors":"Y. Rao, Jireh Yue, Ching-ping Wong","doi":"10.1109/ISAOM.2001.916589","DOIUrl":"https://doi.org/10.1109/ISAOM.2001.916589","url":null,"abstract":"Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer-ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. A novel nano-structure polymer-ceramic composite with very high dielectric constant (/spl epsiv//sub r//spl sim/150, a new record for the highest reported /spl epsiv//sub r/ value for a nano-composite) has been developed in previous work. RF application of embedded capacitors requires that the insulating material have high dielectric constant at high frequency (GHz), low leakage current, high breakdown voltage and high reliability. A set of electrical tests have been conducted in this work to characterize the properties of the in-house developed novel high dielectric constant polymer-ceramic nano-composite. Results show that this material has a fairly high dielectric constant in the RF range, low electrical leakage and high breakdown voltage. An 85/85 TH aging test has been performed and has shown that this novel high-k material has good reliability. An embedded capacitor prototype with capacitance density of 35 nF/cm has been manufactured using this nano-composite with spin coating technology. This novel nano-composite can be used for integral capacitors in RF applications.","PeriodicalId":321904,"journal":{"name":"Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-03-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127873156","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 201