WASPP Program: advanced passivation for advanced packages and harsh environments

Abstract

Military electronic parts are becoming unavailable and military systems are forced to use commercial plastic encapsulated microcircuits (PEMs). PEMs are susceptible to moisture related failure mechanisms occurring from long-term exposure, even at very low humidity levels. Some military systems must operate reliably after 30 years in storage. This presentation covers the latest results of an Army Aviation and Missile Command program to provide near hermetic wafer level sealed devices that also benefits the semiconductor industry. The process shows promise for advanced small-scale packages with little plastic protection that must operate in harsh industrial, automotive, or telecommunications environments. The presentation includes the latest developments of the program, including enabling solutions for "popcorning" and the potential for significant speed improvements in compound semiconductor devices.