电子纸用胶印塑料电路

Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562) Pub Date : 1900-01-01 DOI:10.1109/ISAOM.2001.916556

J. Rogers, K. Baldwin, Zhenan Bao, A. Dodabalapur, V. R. Raju, J. Ewing, K. Amundson

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引用次数: 2

摘要

本文说明了使用一种高分辨率的橡胶冲压形式，称为微接触印刷(/spl mu/CP)，用于为电子纸设计的塑料有源矩阵驱动电路。印刷元件的高分辨率(/spl sim/1 /spl mu/m)，大面积覆盖(/spl sim/1平方英尺)以及这些系统的良好电气性能表明，这些方法，材料和加工顺序可能对塑料电子的实际应用具有吸引力。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Rubber stamped plastic circuits for electronic paper

This paper illustrates the use of a high resolution form of rubber stamping, known as microcontact printing (/spl mu/CP), for patterning plastic active matrix drive circuitry designed for electronic paper. The high resolution (/spl sim/1 /spl mu/m) of the printed elements, the large area coverage (/spl sim/1 sq ft.) and the good electrical performance of these systems suggest that the methods, materials and processing sequences may be attractive for realistic applications of plastic electronics.

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Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562)

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