{"title":"A compact model for early electromigration lifetime estimation","authors":"R. L. de Orio, H. Ceric, S. Selberherr","doi":"10.1109/SISPAD.2011.6035040","DOIUrl":"https://doi.org/10.1109/SISPAD.2011.6035040","url":null,"abstract":"A compact model for early electromigration failures in copper dual-damascene M1/via structures is proposed. The model is derived based on relevant physical effects of the early failure mode, where a rigorous void nucleation model and a simple mechanism for slit void growth are considered. As a result, a simple analytical model for the early electromigration lifetime is obtained. In addition, it is shown that the simulations provide a reasonable estimation for the early lifetimes.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130139296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Analysis of Si, InAs, and Si-InAs tunnel diodes and tunnel FETs using different transport models","authors":"A. Schenk, R. Rhyner, M. Luisier, C. Bessire","doi":"10.1109/SISPAD.2011.6035075","DOIUrl":"https://doi.org/10.1109/SISPAD.2011.6035075","url":null,"abstract":"This paper presents a TCAD study on the performance of Si, InAs, and Si-InAs tunnel diodes and tunnel FETs. Comparative NEGF simulations of short InAs homo-diodes and experimental data on Si homo-diodes serve to calibrate the tunnel models for InAs and Si. Two workarounds for the case of Si-InAs hetero devices are found which give similar results. The crucial difference between in-junction and off-junction band-to-band tunneling is pointed out. Whereas the former cannot yield a sub-thermal slope, the latter can eventually produce a point slope of 25 mV/dec, albeit at extremely small current levels. The TCAD prediction for the maximum on-current of a Si-InAs hetero TFET is 3e-6 A/µm, about 3 orders of magnitude less than world-record CMOS.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114551303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Statistical MOSFET current variation due to variation in surface roughness scattering","authors":"C. Alexander, A. Asenov","doi":"10.1109/SISPAD.2011.6035022","DOIUrl":"https://doi.org/10.1109/SISPAD.2011.6035022","url":null,"abstract":"An efficient and accurate method to include surface roughness scattering from a general, realistic synthesized surface in 3D Monte Carlo simulation is presented with verification. The method is then applied to study drain current variation due to variation in surface roughness scattering in an 18nm bulk Silicon nMOSFET, highlighting substantially increased variation at low drain bias compared with electrostatic drift diffusion simulation.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131817094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
P. Asenov, F. Adamu-Lema, S. Roy, C. Millar, A. Asenov, G. Roy, U. Kovac, D. Reid
{"title":"The effect of compact modelling strategy on SNM and Read Current variability in Modern SRAM","authors":"P. Asenov, F. Adamu-Lema, S. Roy, C. Millar, A. Asenov, G. Roy, U. Kovac, D. Reid","doi":"10.1109/SISPAD.2011.6035024","DOIUrl":"https://doi.org/10.1109/SISPAD.2011.6035024","url":null,"abstract":"It has been shown that sub 100nm SRAM is particularly sensitive to stochastic device variability. In this paper we consider two correlated figures of merit for SRAM, Static Noise Margin (SNM) and Read Current. For the purposes of this paper 1,000 3D atomistic simulations of microscopically different 25nm P and N bulk MOSFETs were performed, and statistical compact models were then extracted for each device. Using these models simulations are performed to calculate the SNM and Read Current distributions of SRAM cells constructed using devices from the device ensemble. Variability in device performance has been then introduced via Gaussian or skewed Gaussian threshold voltages (Vt) and by using values of Vt extracted directly from the individual device compact models and the results of these simulations are then compared to the baseline simulations using fully extracted models. The results clearly demonstrate the errors that can be introduced in the estimation of SNM and Read Current distribution of a 6T SRAM cell when statistical device variability is not correctly modelled.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132392472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Parallel preconditioning for spherical harmonics expansions of the Boltzmann transport equation","authors":"K. Rupp, T. Grasser, A. Jungel","doi":"10.1109/SISPAD.2011.6034963","DOIUrl":"https://doi.org/10.1109/SISPAD.2011.6034963","url":null,"abstract":"While the Monte Carlo method for the Boltzmann transport equation for semiconductors has already been parallelized, this is much more difficult to accomplish for the deterministic spherical harmonics expansion method which requires the solution of a linear system of equations. For the typically employed iterative solvers, preconditioners are required to obtain good convergence rates. These preconditioners are serial in nature and cannot be applied efficiently in a black-box manner to arbitrary systems. Motivated by the underlying physical processes, we present a parallel block-preconditioning scheme that allows us to use existing serial preconditioners in a parallel setting. A reduction of execution times by up to one order of magnitude on current multi-core processors as well as graphics processing units is observed.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"70 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126195307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A wigner function-based determinist method for the simulation of quantum transport in silicon nanowire transistors","authors":"S. Barraud, T. Poiroux, O. Faynot","doi":"10.1109/SISPAD.2011.6035053","DOIUrl":"https://doi.org/10.1109/SISPAD.2011.6035053","url":null,"abstract":"We present a model of quantum transport for Si nanowire transistor that makes use of the Wigner function formalism and takes into account carrier scattering. Scattering effects on current-voltage (I–V) characteristics are assessed using both the relaxation time approximation and the Boltzmann collision operator. Within the Fermi golden rule approximation, the standard collision term is described for both acoustic phonon and surface-roughness interactions. Then, the model is applied to study the impact of each scattering mechanism on short-channel electrical performance of Si nanowire transistors for different gate lengths.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124597245","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
D. Rideau, W. Zhang, Y. Niquet, C. Delerue, C. Tavernier, H. Jaouen
{"title":"Electron-phonon scattering in Si and Ge: From bulk to nanodevices","authors":"D. Rideau, W. Zhang, Y. Niquet, C. Delerue, C. Tavernier, H. Jaouen","doi":"10.1109/SISPAD.2011.6035046","DOIUrl":"https://doi.org/10.1109/SISPAD.2011.6035046","url":null,"abstract":"Using a sp3d5s* tight-binding model for the electrons and a valence force field model for the phonons, we investigate the electron-phonon scattering rates in Si and Ge. The bulk Si mobility calculated with this model (µ = 1400 cm2/V/s) and its temperature dependence agree well with experimental data. We are able to analyze the much lower values obtained in Si nanowires where both carriers and phonons are confined.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116822171","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
W. Vandenberghe, B. Sorée, W. Magnus, G. Groeseneken, A. Verhulst, M. Fischetti
{"title":"Field induced quantum confinement in Indirect Semiconductors: Quantum mechanical and modified semiclassical model","authors":"W. Vandenberghe, B. Sorée, W. Magnus, G. Groeseneken, A. Verhulst, M. Fischetti","doi":"10.1109/SISPAD.2011.6035077","DOIUrl":"https://doi.org/10.1109/SISPAD.2011.6035077","url":null,"abstract":"Going beyond the existing semiclassical approach to calculate band-to-band tunneling (BTBT) current we have developed a quantum mechanical model incorporating confinement effects and multiple electron and hole valleys to calculate the tunnel current in a tunnel field-effect transistor. Comparison with existing semiclassical models reveals a big shift in the onset of tunneling due to energy quantization. We show that the big shift due to quantum confinement is slightly reduced by taking penetration into the gate dielectric into account. We further propose a modified semiclassical model capable of accounting for quantum confinement.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115315570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Numata, S. Uno, Y. Kamakura, N. Mori, K. Nakazato
{"title":"Fully analytic compact model of ballistic gate-all-around MOSFET with rectangular cross section","authors":"T. Numata, S. Uno, Y. Kamakura, N. Mori, K. Nakazato","doi":"10.1109/SISPAD.2011.6035044","DOIUrl":"https://doi.org/10.1109/SISPAD.2011.6035044","url":null,"abstract":"We develop a fully analytic compact model of gate-all-around metal-oxide-semiconductor field-effect transistors in the ballistic transport. The potential shape in the wire cross section is approximated by a parabolic function. With the model potential, electron energy levels are derived analytically and have an unknown parameter. The electron energy levels are determined by solving approximately the coupled equation of charge densities derived from quantum mechanics and electrostatics. We solve the coupled equation with the Aymerich approximation technique. The unknown parameter and also electron energy levels can be derived analytically. Device characteristics calculated from the analytic model are compared with the model with the unknown parameter obtained numerically, demonstrating an excellent accuracy. We carry out a circuit simulation with the analytic model of ballistic gate-all-around metal-oxide-semiconductor field-effect transistors.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124852330","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Z. Essa, P. Boulenc, C. Tavernier, F. Hirigoyen, A. Crocherie, J. Michelot, D. Rideau
{"title":"3D TCAD simulation of advanced CMOS image sensors","authors":"Z. Essa, P. Boulenc, C. Tavernier, F. Hirigoyen, A. Crocherie, J. Michelot, D. Rideau","doi":"10.1109/SISPAD.2011.6035082","DOIUrl":"https://doi.org/10.1109/SISPAD.2011.6035082","url":null,"abstract":"This paper presents a full 3-Dimensionnal TCAD simulation methodology for advanced CMOS image sensors. In order to consider 3D process effects, full 3D TCAD process simulations have been carried out on different advanced pixels. Based upon the obtained 3D doping distributions, 3D opto-electrical device simulation results have been compared to both 2D based approaches and experimental results. Full 3D simulation results show a qualitative agreement with measurements.","PeriodicalId":264913,"journal":{"name":"2011 International Conference on Simulation of Semiconductor Processes and Devices","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-10-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127552974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}