A compact model for early electromigration lifetime estimation

Abstract

A compact model for early electromigration failures in copper dual-damascene M1/via structures is proposed. The model is derived based on relevant physical effects of the early failure mode, where a rigorous void nucleation model and a simple mechanism for slit void growth are considered. As a result, a simple analytical model for the early electromigration lifetime is obtained. In addition, it is shown that the simulations provide a reasonable estimation for the early lifetimes.