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Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93最新文献

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High density overlay interconnect (HDI) delivers high frequency performance for GaAs systems 高密度覆盖互连(HDI)为GaAs系统提供了高频性能
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI: 10.1109/MCMC.1993.302156
M. Gdula, T. Haller, V. Krishnamurthy, G. Forman
{"title":"High density overlay interconnect (HDI) delivers high frequency performance for GaAs systems","authors":"M. Gdula, T. Haller, V. Krishnamurthy, G. Forman","doi":"10.1109/MCMC.1993.302156","DOIUrl":"https://doi.org/10.1109/MCMC.1993.302156","url":null,"abstract":"The authors point out that large die size, high gate and transistor count digital GaAs devices present problems to the system designer, such as efficient distribution of low voltage, high current power supply bias (2 VDC at 25 A, and greater). The effective delivery of such electrical power must also allow for efficient removal of the heat generated by the electronics circuits. By exploiting appropriate MCM technology, these thermal concerns are satisfied while eliminating to a maximum extent conventional circuit packaging parasitics which limit performance of high frequency systems. The overlay interconnect MCM approach used by GE/TI places IC chips first, into a structure for the most advantageous thermal management, while eliminating conventional packaging resistance, inductance and capacitance effects. Several designs constructed with overlay interconnect demonstrate the highest frequency operation and thermal performance of MCMs to date. System designs with 400 MHz and greater clock operation and dissipating 50 W are described.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133083976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Cost-driven layout for thin-film MCMs 薄膜mcm的成本驱动布局
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI: 10.1109/MCMC.1993.302131
W. Dai, David Staepelaere, J. Jue, T. Dayan
{"title":"Cost-driven layout for thin-film MCMs","authors":"W. Dai, David Staepelaere, J. Jue, T. Dayan","doi":"10.1109/MCMC.1993.302131","DOIUrl":"https://doi.org/10.1109/MCMC.1993.302131","url":null,"abstract":"The authors point out that the SURF rubber-band router is designed to meet many of the needs of thin-film MCM layout that are not met by existing PCB tools. The ways that SURF can exploit the flexibility of the rubber-band wiring model to generate layouts that help reduce substrate cost are discussed. Specifically, approaches for reducing the number of metal layers and increasing substrate yield are presented. The results of applying these techniques to several MCM designs are shown. Finally, some future directions for research are described.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124181503","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
MCMs for portable applications 便携式应用的mcm
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI: 10.1109/MCMC.1993.302161
W.B. Baringer, R. Brodersen
{"title":"MCMs for portable applications","authors":"W.B. Baringer, R. Brodersen","doi":"10.1109/MCMC.1993.302161","DOIUrl":"https://doi.org/10.1109/MCMC.1993.302161","url":null,"abstract":"The authors point out that multichip modules (MCMs) provide many advantages in the implementation of portable systems. For digital circuitry, MCMs provide size reduction and reduced power dissipation, and they facilitate architectural voltage scaling. Future portable devices will make increased use of wireless communications. The size of the passive RF elements such as inductors, capacitors, and antennas will be much greater than that of the digital radio circuitry. These passive filter components can be integrated directly into the MCM layers, providing additional size and power reductions.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"2013 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127433287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Yield analysis and optimization of VLSI interconnects in multichip modules 多芯片模块VLSI互连的良率分析与优化
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI: 10.1109/MCMC.1993.302134
Qi-Jun Zhang, M. Nakhla
{"title":"Yield analysis and optimization of VLSI interconnects in multichip modules","authors":"Qi-Jun Zhang, M. Nakhla","doi":"10.1109/MCMC.1993.302134","DOIUrl":"https://doi.org/10.1109/MCMC.1993.302134","url":null,"abstract":"A CAD approach integrating multidimensional correlated Monte-Carlo analysis and generalized l/sub 1/ optimization with lossy transmission line network simulations is presented. It is implemented in a CAD framework for statistical analysis and yield optimization of high-speed VLSI interconnects. Physical/geometrical based hierarchical Monte-Carlo analysis and yield optimization examples are presented.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116627429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
A multichip module design for portable video compression systems 便携式视频压缩系统的多芯片模块设计
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI: 10.1109/MCMC.1993.302155
C. Chang, B. Sheu
{"title":"A multichip module design for portable video compression systems","authors":"C. Chang, B. Sheu","doi":"10.1109/MCMC.1993.302155","DOIUrl":"https://doi.org/10.1109/MCMC.1993.302155","url":null,"abstract":"The multichip module (MCM) design of standard video compression algorithms is presented based on the currently available known good dies. The CCITT H.261 chip sets include chips for motion estimation, DCT and IDCT, forward and inverse quantization, Huffman coding and decoding, error correction, and loop filtering. The data compression standard is implemented in several separate chips instead of a giant chip to achieve high manufacturing yields. To realize a compact hardware design, the MCM approach is most suitable. The designs are focused on chip sets that are based on the data compression standard for videophone and video-conferencing applications.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127670425","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Transient waveform estimation of high-speed MCM networks using complex frequency hopping 基于复跳频的高速MCM网络瞬态波形估计
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI: 10.1109/MCMC.1993.302138
E. Chiprout, M. Nakhla
{"title":"Transient waveform estimation of high-speed MCM networks using complex frequency hopping","authors":"E. Chiprout, M. Nakhla","doi":"10.1109/MCMC.1993.302138","DOIUrl":"https://doi.org/10.1109/MCMC.1993.302138","url":null,"abstract":"The authors point out that moment-matching techniques that have been proposed for efficient transient waveform estimation of interconnect networks used in modeling MCMs can be inaccurate in high-speed systems by failing to detect some of the dominant high frequency network poles which lie far from the expansion point but near the imaginary axis in the frequency plane. Here, an approach for generating, with an accuracy check, all the dominant poles within the frequency range of interest using complex frequency hopping (CFH) is presented. The method, based on a binary search strategy, uses multiport complex moment-matching in the frequency s plane. CFH allows for the efficient analysis of large networks which include lossy, coupled transmission lines and nonlinear terminations, with estimated waveforms converging to simulation accuracy. Several examples which demonstrate the accuracy of the proposed technique are presented.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130107394","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 31
Reliability by design for MCM manufacturing the roadmap and an example 可靠性设计为MCM制造提供了路线图和实例
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI: 10.1109/MCMC.1993.302144
Nien-Tsu Shen, J. Yang
{"title":"Reliability by design for MCM manufacturing the roadmap and an example","authors":"Nien-Tsu Shen, J. Yang","doi":"10.1109/MCMC.1993.302144","DOIUrl":"https://doi.org/10.1109/MCMC.1993.302144","url":null,"abstract":"Reliability by design for high-density thin-film multichip module (MCM) manufacturing is discussed. The roadmap and examples are based upon the experience and knowledge obtained from the Digital VAX9000 mainframe MCU technology through all phases of the program. Current successful development of a low power R3000 RISC MCM design application for desktop workstations which utilizes the concurrent engineering approach to achieve higher CPU system performance at a reasonable cost and timeframe is also reviewed.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125006177","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Design for packageability-the impact of bonding technology on the size and layout of VLSI dies 可封装性设计——键合技术对超大规模集成电路芯片尺寸和布局的影响
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI: 10.1109/MCMC.1993.302135
P. Dehkordi, D. Bouldin
{"title":"Design for packageability-the impact of bonding technology on the size and layout of VLSI dies","authors":"P. Dehkordi, D. Bouldin","doi":"10.1109/MCMC.1993.302135","DOIUrl":"https://doi.org/10.1109/MCMC.1993.302135","url":null,"abstract":"The impact of bonding technology from an IC designer's point of view is studied. Work by others has concentrated just on the effect of packaging alone, whereas this study investigates the effect of changing the VLSI dies. Specifically, the impact of wire-bond and flip-chip technologies on the size and layout of VLSI dies is demonstrated by means of general discussion and detailed examples. Three VLSI chips of various sizes and I/O requirements have been synthesized based on a standard-cell library for both wire-bond and flip-chip. The results show different die layouts and sizes can be achieved based on the choice of wire-bond or flip-chip technologies.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125634034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 26
A broad band loss model for MCM interconnections MCM互连的宽带损耗模型
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI: 10.1109/MCMC.1993.302142
J. Peeters, E. Beyne, G. Brandli
{"title":"A broad band loss model for MCM interconnections","authors":"J. Peeters, E. Beyne, G. Brandli","doi":"10.1109/MCMC.1993.302142","DOIUrl":"https://doi.org/10.1109/MCMC.1993.302142","url":null,"abstract":"Conductive losses of multichip module interconnections are analyzed. A distributed network model for the conductor surface impedance is extended to include transition to DC resistivity and the effect of barrier and adhesion layers. Using the model, a broadband loss expression suitable for use in fast Fourier transform (FFT)-based transient analysis network simulators for digital signal transmission on lossy interconnections is derived. The expression is used to model measured scattering parameter characteristics up to 18 GHz, for different line types. Excellent correspondence between measurements and simulations is achieved, even when magnetic effects of a thick nickel barrier layer are involved. Finally, the models are incorporated in a transient analysis network simulation program.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129484915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Implementation of a MCM brokerage service MCM经纪服务的实现
Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI: 10.1109/MCMC.1993.302153
C. A. Pina
{"title":"Implementation of a MCM brokerage service","authors":"C. A. Pina","doi":"10.1109/MCMC.1993.302153","DOIUrl":"https://doi.org/10.1109/MCMC.1993.302153","url":null,"abstract":"An innovative approach to providing access to low cost commercial multichip module (MCM) prototype fabrication through the use of a brokerage service is discussed. This service will be patterned after the existing IC prototyping service MOSIS. Benefits include cost sharing between the users of the service as well as simplified interfaces to MCM fabricators.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121123235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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