{"title":"便携式应用的mcm","authors":"W.B. Baringer, R. Brodersen","doi":"10.1109/MCMC.1993.302161","DOIUrl":null,"url":null,"abstract":"The authors point out that multichip modules (MCMs) provide many advantages in the implementation of portable systems. For digital circuitry, MCMs provide size reduction and reduced power dissipation, and they facilitate architectural voltage scaling. Future portable devices will make increased use of wireless communications. The size of the passive RF elements such as inductors, capacitors, and antennas will be much greater than that of the digital radio circuitry. These passive filter components can be integrated directly into the MCM layers, providing additional size and power reductions.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"2013 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"MCMs for portable applications\",\"authors\":\"W.B. Baringer, R. Brodersen\",\"doi\":\"10.1109/MCMC.1993.302161\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors point out that multichip modules (MCMs) provide many advantages in the implementation of portable systems. For digital circuitry, MCMs provide size reduction and reduced power dissipation, and they facilitate architectural voltage scaling. Future portable devices will make increased use of wireless communications. The size of the passive RF elements such as inductors, capacitors, and antennas will be much greater than that of the digital radio circuitry. These passive filter components can be integrated directly into the MCM layers, providing additional size and power reductions.<<ETX>>\",\"PeriodicalId\":143140,\"journal\":{\"name\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"volume\":\"2013 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1993.302161\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1993.302161","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The authors point out that multichip modules (MCMs) provide many advantages in the implementation of portable systems. For digital circuitry, MCMs provide size reduction and reduced power dissipation, and they facilitate architectural voltage scaling. Future portable devices will make increased use of wireless communications. The size of the passive RF elements such as inductors, capacitors, and antennas will be much greater than that of the digital radio circuitry. These passive filter components can be integrated directly into the MCM layers, providing additional size and power reductions.<>
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