MCM经纪服务的实现

C. A. Pina
{"title":"MCM经纪服务的实现","authors":"C. A. Pina","doi":"10.1109/MCMC.1993.302153","DOIUrl":null,"url":null,"abstract":"An innovative approach to providing access to low cost commercial multichip module (MCM) prototype fabrication through the use of a brokerage service is discussed. This service will be patterned after the existing IC prototyping service MOSIS. Benefits include cost sharing between the users of the service as well as simplified interfaces to MCM fabricators.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"110 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Implementation of a MCM brokerage service\",\"authors\":\"C. A. Pina\",\"doi\":\"10.1109/MCMC.1993.302153\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An innovative approach to providing access to low cost commercial multichip module (MCM) prototype fabrication through the use of a brokerage service is discussed. This service will be patterned after the existing IC prototyping service MOSIS. Benefits include cost sharing between the users of the service as well as simplified interfaces to MCM fabricators.<<ETX>>\",\"PeriodicalId\":143140,\"journal\":{\"name\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"volume\":\"110 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1993.302153\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1993.302153","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

讨论了一种创新的方法,通过使用经纪服务来提供低成本的商业多芯片模块(MCM)原型制造。这项服务将在现有的IC原型服务MOSIS的基础上进行设计。好处包括服务用户之间的成本分摊以及与MCM制造商的简化接口。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Implementation of a MCM brokerage service
An innovative approach to providing access to low cost commercial multichip module (MCM) prototype fabrication through the use of a brokerage service is discussed. This service will be patterned after the existing IC prototyping service MOSIS. Benefits include cost sharing between the users of the service as well as simplified interfaces to MCM fabricators.<>
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信