{"title":"MCM经纪服务的实现","authors":"C. A. Pina","doi":"10.1109/MCMC.1993.302153","DOIUrl":null,"url":null,"abstract":"An innovative approach to providing access to low cost commercial multichip module (MCM) prototype fabrication through the use of a brokerage service is discussed. This service will be patterned after the existing IC prototyping service MOSIS. Benefits include cost sharing between the users of the service as well as simplified interfaces to MCM fabricators.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"110 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Implementation of a MCM brokerage service\",\"authors\":\"C. A. Pina\",\"doi\":\"10.1109/MCMC.1993.302153\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An innovative approach to providing access to low cost commercial multichip module (MCM) prototype fabrication through the use of a brokerage service is discussed. This service will be patterned after the existing IC prototyping service MOSIS. Benefits include cost sharing between the users of the service as well as simplified interfaces to MCM fabricators.<<ETX>>\",\"PeriodicalId\":143140,\"journal\":{\"name\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"volume\":\"110 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1993.302153\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1993.302153","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An innovative approach to providing access to low cost commercial multichip module (MCM) prototype fabrication through the use of a brokerage service is discussed. This service will be patterned after the existing IC prototyping service MOSIS. Benefits include cost sharing between the users of the service as well as simplified interfaces to MCM fabricators.<>