Yield analysis and optimization of VLSI interconnects in multichip modules

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI:10.1109/MCMC.1993.302134

Qi-Jun Zhang, M. Nakhla

引用次数: 11

Abstract

A CAD approach integrating multidimensional correlated Monte-Carlo analysis and generalized l/sub 1/ optimization with lossy transmission line network simulations is presented. It is implemented in a CAD framework for statistical analysis and yield optimization of high-speed VLSI interconnects. Physical/geometrical based hierarchical Monte-Carlo analysis and yield optimization examples are presented.<>

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多芯片模块VLSI互连的良率分析与优化

提出了一种将多维相关蒙特卡罗分析和广义l/sub /优化相结合的输电线网络有损仿真CAD方法。该方法在用于高速VLSI互连统计分析和良率优化的CAD框架中实现。给出了基于物理/几何的分层蒙特卡罗分析和良率优化实例。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93

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