Reliability by design for MCM manufacturing the roadmap and an example

Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93 Pub Date : 1993-03-15 DOI:10.1109/MCMC.1993.302144

Nien-Tsu Shen, J. Yang

引用次数: 2

Abstract

Reliability by design for high-density thin-film multichip module (MCM) manufacturing is discussed. The roadmap and examples are based upon the experience and knowledge obtained from the Digital VAX9000 mainframe MCU technology through all phases of the program. Current successful development of a low power R3000 RISC MCM design application for desktop workstations which utilizes the concurrent engineering approach to achieve higher CPU system performance at a reasonable cost and timeframe is also reviewed.<>

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可靠性设计为MCM制造提供了路线图和实例

讨论了高密度薄膜多芯片模块(MCM)制造设计的可靠性问题。该路线图和示例是基于从数字VAX9000大型机MCU技术中获得的经验和知识，通过程序的各个阶段。目前成功开发的低功耗R3000 RISC MCM设计应用于桌面工作站，它利用并行工程方法在合理的成本和时间框架内实现更高的CPU系统性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93

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