{"title":"薄膜mcm的成本驱动布局","authors":"W. Dai, David Staepelaere, J. Jue, T. Dayan","doi":"10.1109/MCMC.1993.302131","DOIUrl":null,"url":null,"abstract":"The authors point out that the SURF rubber-band router is designed to meet many of the needs of thin-film MCM layout that are not met by existing PCB tools. The ways that SURF can exploit the flexibility of the rubber-band wiring model to generate layouts that help reduce substrate cost are discussed. Specifically, approaches for reducing the number of metal layers and increasing substrate yield are presented. The results of applying these techniques to several MCM designs are shown. Finally, some future directions for research are described.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"21 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Cost-driven layout for thin-film MCMs\",\"authors\":\"W. Dai, David Staepelaere, J. Jue, T. Dayan\",\"doi\":\"10.1109/MCMC.1993.302131\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors point out that the SURF rubber-band router is designed to meet many of the needs of thin-film MCM layout that are not met by existing PCB tools. The ways that SURF can exploit the flexibility of the rubber-band wiring model to generate layouts that help reduce substrate cost are discussed. Specifically, approaches for reducing the number of metal layers and increasing substrate yield are presented. The results of applying these techniques to several MCM designs are shown. Finally, some future directions for research are described.<<ETX>>\",\"PeriodicalId\":143140,\"journal\":{\"name\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"volume\":\"21 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1993.302131\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1993.302131","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The authors point out that the SURF rubber-band router is designed to meet many of the needs of thin-film MCM layout that are not met by existing PCB tools. The ways that SURF can exploit the flexibility of the rubber-band wiring model to generate layouts that help reduce substrate cost are discussed. Specifically, approaches for reducing the number of metal layers and increasing substrate yield are presented. The results of applying these techniques to several MCM designs are shown. Finally, some future directions for research are described.<>
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