{"title":"可靠性设计为MCM制造提供了路线图和实例","authors":"Nien-Tsu Shen, J. Yang","doi":"10.1109/MCMC.1993.302144","DOIUrl":null,"url":null,"abstract":"Reliability by design for high-density thin-film multichip module (MCM) manufacturing is discussed. The roadmap and examples are based upon the experience and knowledge obtained from the Digital VAX9000 mainframe MCU technology through all phases of the program. Current successful development of a low power R3000 RISC MCM design application for desktop workstations which utilizes the concurrent engineering approach to achieve higher CPU system performance at a reasonable cost and timeframe is also reviewed.<<ETX>>","PeriodicalId":143140,"journal":{"name":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Reliability by design for MCM manufacturing the roadmap and an example\",\"authors\":\"Nien-Tsu Shen, J. Yang\",\"doi\":\"10.1109/MCMC.1993.302144\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Reliability by design for high-density thin-film multichip module (MCM) manufacturing is discussed. The roadmap and examples are based upon the experience and knowledge obtained from the Digital VAX9000 mainframe MCU technology through all phases of the program. Current successful development of a low power R3000 RISC MCM design application for desktop workstations which utilizes the concurrent engineering approach to achieve higher CPU system performance at a reasonable cost and timeframe is also reviewed.<<ETX>>\",\"PeriodicalId\":143140,\"journal\":{\"name\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"volume\":\"32 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1993.302144\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1993 IEEE Multi-Chip Module Conference MCMC-93","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1993.302144","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability by design for MCM manufacturing the roadmap and an example
Reliability by design for high-density thin-film multichip module (MCM) manufacturing is discussed. The roadmap and examples are based upon the experience and knowledge obtained from the Digital VAX9000 mainframe MCU technology through all phases of the program. Current successful development of a low power R3000 RISC MCM design application for desktop workstations which utilizes the concurrent engineering approach to achieve higher CPU system performance at a reasonable cost and timeframe is also reviewed.<>
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