Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'最新文献_第4页

Iterative capacity allocation and production flow estimation for scheduling semiconductor fabrication 半导体制造调度的迭代产能分配和生产流程估计

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526212

Shi-Chung Chang, L. Lee, Lee-Sing Pang, Tien-Ying Chen, Yi-Chen Weng, Huei-Der Chiang, Dennis W. T. Dai

引用次数: 8

Correlation between yield and waiting time: a quantitative study 产量与等待时间的相关性:一项定量研究

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526094

K. Srinivasan, R. Sandell, S. Brown

引用次数: 11

Flux activity evaluation using the wetting balance 利用润湿平衡评价通量活度

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526185

C. Huang, K. Srihari, A. McLenaghan, G. Westby

{"title":"Flux activity evaluation using the wetting balance","authors":"C. Huang, K. Srihari, A. McLenaghan, G. Westby","doi":"10.1109/IEMT.1995.526185","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526185","url":null,"abstract":"The selection of soldering flux plays a critical role in determining the manufacturing yield and product reliability of printed circuit board assemblies. Fluxes are used to remove oxides and other contaminants on the component leads and the pads on the printed circuit board. They also assist in the transfer of heat. The selection of flux should depend on properties such as its ability to remove the (oxides) tarnish film, activation temperature, corrosiveness, and the resistivity of post process residues. The activity level of a flux influences its ability to clean the oxides on the specimen's surface and to promote wetting. It (the flux activity level) may be altered by changing the contents of the activators that make-up the flux chemistry. This research provides an approach to evaluate the influence of the flux activity in promoting wetting through the use of wetting balance analysis. Standardized specimens were used along with a set of specified test variables. The experimental procedure was determined based on the information obtained through initial experiments. The results obtained can serve as a bench mark for evaluating candidate fluxes for future use in the manufacturing process.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131348515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

Plasma process control with optical emission spectroscopy 等离子体过程控制的光学发射光谱

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526109

P. P. Ward

{"title":"Plasma process control with optical emission spectroscopy","authors":"P. P. Ward","doi":"10.1109/IEMT.1995.526109","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526109","url":null,"abstract":"Plasma processes for etching and desmear of electronic components and printed wiring boards (PWB) are difficult to predict and control. Non-uniformity of most plasma processes and sensitivity to environmental changes make it difficult to maintain process stability from day to day. To assure plasma process performance, weight loss coupons or post-plasma destructive testing must be used. The problem with these techniques is that they are not real-time methods and do not allow for immediate diagnosis and process correction. These tests often require scrapping some fraction of a batch to insure the integrity of the rest. Since these tests verify a successful cycle with post-plasma diagnostics, poor test results often determine that a batch is substandard and the resulting parts unusable. These tests are a costly part of the overall fabrication cost. A more efficient method of testing would allow for constant monitoring of plasma conditions and process control. Process anomalies should be detected and corrected before the parts being treated are damaged. Real time monitoring would allow for instantaneous corrections. Multiple site monitoring would allow for process mapping within one system or simultaneous monitoring of multiple systems. Optical emission spectroscopy conducted external to the plasma apparatus would allow for this sort of multifunctional analysis without perturbing the glow discharge. In this paper, optical emission spectroscopy for non-intrusive, in situ process control is explored along with applications of this technique towards process control, failure analysis and endpoint determination.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131853144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Impact of minienvironments on facilities cost 微型环境对设施成本的影响

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526128

W. Barnett, R. K. Schneider

引用次数: 2

Laser micromachining of through via interconnects in active die for 3D multichip module 三维多芯片模块主动模中通孔互连的激光微加工

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526103

D. Chu, W. D. Miller

{"title":"Laser micromachining of through via interconnects in active die for 3D multichip module","authors":"D. Chu, W. D. Miller","doi":"10.1109/IEMT.1995.526103","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526103","url":null,"abstract":"One method to increase density in integrated circuits (IC) is to stack die to create a 3D multichip module (MCM). In the past, special post wafer processing was done to bring interconnects out to the edge of the die. The die were sawed, glued, and stacked. Special processing was done to create interconnects on the edge to provide for interconnects to each of the die. These processes require an IC type fabrication facility (fab) and special processing equipment. In contrast we have developed packaging assembly methods to created vertical through vias in bond pads of active silicon die, isolate these vias, and metal fill these vias without the use of a special IC fab. These die with through vias can then be joined and stacked to create a 3D MCM. Vertical through vias in active die are created by laser micromachining using a Nd:YAG laser. Besides the fundamental 1064 nm (infra-red) laser wavelength of a Nd:YAG laser, modifications to our Nd:YAG laser allowed us to generate the second harmonic 532 nm (green) laser wavelength and fourth harmonic 266 nm (ultra violet) laser wavelength in laser micromachining for these vias. Experiments were conducted to determine the best laser wavelengths to use for laser micromachining of vertical through vias in order to minimize damage to the active die. Via isolation experiments were done in order determine the best method in isolating the bond pads of the die. Die thinning techniques were developed to allow for die thickness us thin as 50 /spl mu/m. This would allow for high 3D density when the die are stacked. A method was developed to metal fill the vias with solder using a wire bonder with solder wire.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131964912","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

COB and COC for low cost and high density package COB和COC用于低成本和高密度封装

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526101

G. Rochat

引用次数: 2

Total contamination control: the minienvironment era 全面污染控制:小环境时代

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526125

S. Abuzeid

引用次数: 5

Issues in low-cost manufacture of reliable optoelectronic systems 低成本制造可靠光电系统的问题

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526204

S. Leclerc, G. Subbarayan

引用次数: 0

How TOC & TPM work together to build the quality toolbox of SDWTs TOC和TPM如何共同构建SDWTs的质量工具箱

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526092

E. Rose, R. Odom, R. Dunbar, J. Hinchman

引用次数: 8