COB和COC用于低成本和高密度封装

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI:10.1109/IEMT.1995.526101

G. Rochat

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引用次数: 2

摘要

今天，便携式电子设备比几年前的同类非便携式产品具有更多的功能。当设计人员面对小型化时，相似规则不再有效，因此有必要寻找和开发集成电路的封装和互连的新方法。通过将熟练掌握的片上芯片(COB)技术与非常精确的贴片工艺相结合，可以为需要3D组装以实现更高水平小型化的工程师提供廉价的片上芯片(COC)解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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COB and COC for low cost and high density package

Today, portable electronic devices have many more functions than the same type of nonportable products had a few years ago. As the similitude rules are no longer valid when designers are faced with miniaturization, it is necessary to find and develop new approaches for the packaging and the interconnections of the integrated circuits. By using a well mastered Chip-On-Board (COB) technology in association with a very accurate die attach process, it is possible to offer an inexpensive Chip-On-Chip (COC) solution to the engineers who need a 3D assembly for a higher level of miniaturization.

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来源期刊

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'

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