Total contamination control: the minienvironment era

S. Abuzeid
{"title":"Total contamination control: the minienvironment era","authors":"S. Abuzeid","doi":"10.1109/IEMT.1995.526125","DOIUrl":null,"url":null,"abstract":"Semiconductor manufacturers clearly recognize that shrinking geometries in semiconductor devices require more stringent process and contamination control. The application of isolation technology for the reduction and control of particulate contamination levels has moved from the development and evaluation stage to its current status as a preferred alternative for new semiconductor manufacturing facilities. A system based on Standard Mechanical Interfaces (SMIF), which uses clean isolation technology to protect the integrity of the wafers during processing, storage and transportation within the facility, is described. An extension of the same principle of isolation, based on the SMIF-technology, enables a selected inert environment to be furnished in the process tool area as well as in the transport and storage containers. The technology enables control of particles, oxygen and water vapor levels (to the 10 PPM range), organic vapor and gas phase contaminant. The capabilities of the minienvironment technology and its benefits are analyzed.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"238 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1995.526125","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

Semiconductor manufacturers clearly recognize that shrinking geometries in semiconductor devices require more stringent process and contamination control. The application of isolation technology for the reduction and control of particulate contamination levels has moved from the development and evaluation stage to its current status as a preferred alternative for new semiconductor manufacturing facilities. A system based on Standard Mechanical Interfaces (SMIF), which uses clean isolation technology to protect the integrity of the wafers during processing, storage and transportation within the facility, is described. An extension of the same principle of isolation, based on the SMIF-technology, enables a selected inert environment to be furnished in the process tool area as well as in the transport and storage containers. The technology enables control of particles, oxygen and water vapor levels (to the 10 PPM range), organic vapor and gas phase contaminant. The capabilities of the minienvironment technology and its benefits are analyzed.
全面污染控制:小环境时代
半导体制造商清楚地认识到,半导体器件的收缩几何形状需要更严格的工艺和污染控制。隔离技术在减少和控制颗粒污染水平方面的应用已经从开发和评估阶段发展到目前作为新半导体制造设施的首选替代方案。描述了一种基于标准机械接口(SMIF)的系统,该系统使用清洁隔离技术来保护晶圆在设备内加工,储存和运输过程中的完整性。基于smif技术的同一隔离原理的扩展,可以在过程工具区域以及运输和存储容器中提供选定的惰性环境。该技术可以控制颗粒,氧气和水蒸气水平(10 PPM范围内),有机蒸汽和气相污染物。分析了微环境技术的性能及其优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信