COB and COC for low cost and high density package

Abstract

Today, portable electronic devices have many more functions than the same type of nonportable products had a few years ago. As the similitude rules are no longer valid when designers are faced with miniaturization, it is necessary to find and develop new approaches for the packaging and the interconnections of the integrated circuits. By using a well mastered Chip-On-Board (COB) technology in association with a very accurate die attach process, it is possible to offer an inexpensive Chip-On-Chip (COC) solution to the engineers who need a 3D assembly for a higher level of miniaturization.