Correlation between yield and waiting time: a quantitative study

K. Srinivasan, R. Sandell, S. Brown
{"title":"Correlation between yield and waiting time: a quantitative study","authors":"K. Srinivasan, R. Sandell, S. Brown","doi":"10.1109/IEMT.1995.526094","DOIUrl":null,"url":null,"abstract":"Using SEMATECH yield modeling techniques, the effect of reductions in cycle time and of improvements in environmental cleanliness is projected to die-per-wafer yield gains in semiconductor wafer fabrication. This study provides a methodology to determine the impact upon the total process yield of the factory as a result of shortening queue times. Modeling a fabrication facility that uses a 0.25 micron high-performance logic (1poly, 4metal) process flow, the methodology is used to determine variations in yield at different concentrations of airborne particles. In turn, the methodology provides guidelines for implementing operational strategies intended to achieve increases in total process yield.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"46 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1995.526094","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

Abstract

Using SEMATECH yield modeling techniques, the effect of reductions in cycle time and of improvements in environmental cleanliness is projected to die-per-wafer yield gains in semiconductor wafer fabrication. This study provides a methodology to determine the impact upon the total process yield of the factory as a result of shortening queue times. Modeling a fabrication facility that uses a 0.25 micron high-performance logic (1poly, 4metal) process flow, the methodology is used to determine variations in yield at different concentrations of airborne particles. In turn, the methodology provides guidelines for implementing operational strategies intended to achieve increases in total process yield.
产量与等待时间的相关性:一项定量研究
利用SEMATECH良率建模技术,缩短周期时间和改善环境清洁度的影响被预测为半导体晶圆制造中每片晶圆的良率增益。本研究提供了一种方法来确定由于缩短排队时间而对工厂的总工艺产量的影响。该方法模拟了一个使用0.25微米高性能逻辑(1聚,4金属)工艺流程的制造设施,用于确定不同浓度空气中颗粒的产量变化。反过来,该方法为实施旨在实现总工艺产量增加的操作策略提供指导方针。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信