{"title":"Mounting technology of BGA-P and BGA-T","authors":"D. Hattas, A. Wakigawa","doi":"10.1109/IEMT.1995.526197","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526197","url":null,"abstract":"The BGA is not as easy to inspect or repair as other package formats. The feasibility of its practical application hinges, therefore, on the condition that its bonding rate and solder defect level is superior to that of the QFP. In order to promote the spread of BGAs, there is a pressing need to establish a process for ensuring high bonding reliability. In this report, we present the mounting test on a BGA-P with 225 pins and a BGA-T with 426 pins. We hope that this information will contribute to spurring the adoption of the BGAs.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123445442","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Production improvements using a forward scheduler","authors":"R.C. Juba, P. Keller, A.F. Verity","doi":"10.1109/IEMT.1995.526116","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526116","url":null,"abstract":"One of the fabricators at the IBM Microelectronics Division's manufacturing facility in Essex Junction, Vermont, is a high volume producer of DRAM's and advanced logic products. The wafer processing line is controlled by several custom software systems distributed over multiple mainframe host computers. The IBM Forward Scheduler used in this fabricator is a product scheduling system that provides an environment where information from many CIM system data sources can be integrated. Four times each day, data is automatically downloaded to an IBM RS/6000 workstation from sources containing information related to work in progress (WIP), product routings, operations, parts, and tools. The data is inspected, processed and converted to a file format consistent with Tyecin's 'ManSim' software, a commercial manufacturing simulator. A simulation of the manufacturing line is run for 48 hours, generating several short-term dispatch reports by fabricator, area, and workstation. The reports, which contain hourly projections of product movement, are then uploaded from the RS/6000 to a VM machine, viewed and used by manufacturing personnel for future tool and labor allocation (e.g., scheduling of meetings, preventive maintenance, overtime and vacation, and tool deployment). This paper describes the software system and interfaces of the Forward Scheduler as well as the issues involved with calibrating a short-term line simulator, how manufacturing personnel use the simulated data, and the system design features that minimize maintenance on the Forward Scheduler.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127719724","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Underfill flow as viscous flow between parallel plates driven by capillary action","authors":"M. K. Schwiebert, William H Leong","doi":"10.1109/IEMT.1995.526083","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526083","url":null,"abstract":"Epoxy underfill is often required to enhance the reliability of flip-chip interconnects. This study evaluates the flow of filled epoxy underfill materials between parallel plates driven by capillary action. An exact model was developed to understand the functional relationship between flow distance, flow time, separation distance, surface tension, and viscosity for quasi-steady laminar flow between parallel plates. The model was verified experimentally with a typical underfill material. The measured values of flow distance agreed well with the exact model. A new material parameter, the coefficient of planar penetrance, is introduced. This parameter measures the penetrating power of a liquid between parallel plates driven by capillary action. The effectiveness of gravity and vacuum as flow rate enhancements are explored.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"247 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123363440","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A novel structure to realize crack-free plastic package during reflow soldering process-development of CSS (chip side support) package","authors":"T. Nakazawa, Y. Unoue, K. Sawada, T. Sudo","doi":"10.1109/IEMT.1995.526180","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526180","url":null,"abstract":"Reports a novel structure of a plastic package without a die-pad whereby adhesion strength is improved and thermal stress reduced. The non-die-pad structure has been realized by the chip side support (CSS) method. Furthermore, this paper describes the derivation of an equation that can be used as a criterion for judging package cracking or delamination by comparing the shear strength with the shear stress. The equation for shear stress can be estimated by the finite element method.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128258722","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}